Proto Board Type: SMD to PGA, Package Accepted: TQFP, Number of Positions: 144, Pitch: 0.016" (0.40mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 36, Pitch: 0.035" (0.90mm),
Proto Board Type: SMD to DIP, Package Accepted: LGA, Number of Positions: 10, Pitch: 0.016" (0.40mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: TSSOP, Number of Positions: 64, Pitch: 0.020" (0.50mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SOP, Number of Positions: 36, Pitch: 0.026" (0.65mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: TSSOP, Number of Positions: 44, Pitch: 0.025" (0.64mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: DFN, Number of Positions: 10, Pitch: 0.016" (0.40mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 14, Pitch: 0.020" (0.50mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: PowerSOIC, Number of Positions: 28, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SSOP, Number of Positions: 24, Pitch: 0.039" (1.00mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: PowerSOIC, Number of Positions: 24, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Package Accepted: RQFP, QFP, Number of Positions: 240, Pitch: 0.020" (0.50mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 24, Pitch: 0.020" (0.50mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: BGA, Number of Positions: 24, Pitch: 0.039" (1.00mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pitch: 0.047" (1.20mm),
Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 28, Pitch: 0.020" (0.50mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Package Accepted: PQFP, Number of Positions: 100, Pitch: 0.026" (0.65mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: PowerSOIC, Number of Positions: 16, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 2, Pitch: 0.020" (0.50mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: BGA, Number of Positions: 25, Pitch: 0.039" (1.00mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Package Accepted: LCC, JLCC, PLCC, Number of Positions: 84, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: TQFP, Number of Positions: 80, Pitch: 0.031" (0.80mm),
Proto Board Type: SMD to PGA, Package Accepted: LQFP, PQFP, Number of Positions: 128, Pitch: 0.020" (0.50mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: MSOP, Number of Positions: 12, Pitch: 0.026" (0.65mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: DFN, MLP, Number of Positions: 8, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 28, Pitch: 0.026" (0.65mm),
Proto Board Type: SMD to DIP, Package Accepted: DFN, Number of Positions: 8, Pitch: 0.038" (0.97mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: TSSOP, Number of Positions: 56, Pitch: 0.020" (0.50mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: DFN, Number of Positions: 12, Pitch: 0.020" (0.50mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: TSSOP, Number of Positions: 48, Pitch: 0.020" (0.50mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 32, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: DFN, Number of Positions: 8, Pitch: 0.018" (0.45mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Package Accepted: LQFP, Number of Positions: 128, Pitch: 0.020" (0.50mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SOP, Number of Positions: 8,
Proto Board Type: SMD to DIP, Package Accepted: SSOP, TSSOP, Number of Positions: 28, Pitch: 0.026" (0.65mm),
