Proto Board Type: SMD to DIP, Package Accepted: DFN, Number of Positions: 8, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 32, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 20, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: TVSOP, Number of Positions: 16, Pitch: 0.016" (0.40mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: MLP, MLF, Number of Positions: 28, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: DFN, Number of Positions: 8, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 12, Pitch: 0.016" (0.40mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: LGA, Number of Positions: 28, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: LLP, Number of Positions: 6, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 36, Pitch: 0.031" (0.80mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: DFN, Number of Positions: 16, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: TQFP, Number of Positions: 64, Pitch: 0.039" (1.00mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: LGA, Number of Positions: 8, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 8, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: DFN, Number of Positions: 6, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: DFN, Number of Positions: 10, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: LLP, Number of Positions: 16, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: PLCC, Number of Positions: 4, Pitch: 0.059" (1.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: DFN, Number of Positions: 12, Pitch: 0.018" (0.45mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: TSOP, Number of Positions: 44, Pitch: 0.031" (0.80mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: QFN THIN, Number of Positions: 36, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: MiniSOIC, Number of Positions: 10, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: MLP, MLF, Number of Positions: 20, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: MLP, MLF, Number of Positions: 16, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: LLP, Number of Positions: 8, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: LCC, JLCC, PLCC, Number of Positions: 28, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: DFN, Number of Positions: 6, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: TSSOP, Number of Positions: 10, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 72, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: TQFP, Number of Positions: 44, Pitch: 0.031" (0.80mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SOT-563F, Number of Positions: 6, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: DFN, Number of Positions: 12, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: FPC Connector, Number of Positions: 20, Pitch: 0.049" (1.25mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 40, Pitch: 0.016" (0.40mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
