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Adapter, Breakout Boards

PA0168
Chip Quik Inc.

PA0168

part stock: 23031

Proto Board Type: SMD to DIP, Package Accepted: MiniSOIC, Number of Positions: 8, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
IPC0083
Chip Quik Inc.

IPC0083

part stock: 15381

Proto Board Type: SMD to DIP, Package Accepted: DFN, Number of Positions: 6, Pitch: 0.037" (0.95mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA0011
Chip Quik Inc.

PA0011

part stock: 12740

Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 28, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
IPC0070
Chip Quik Inc.

IPC0070

part stock: 11658

Proto Board Type: SMD to DIP, Package Accepted: DFN, Number of Positions: 12, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA0109
Chip Quik Inc.

PA0109

part stock: 3772

Proto Board Type: SMD to DIP, Package Accepted: TQFP, VQFP, Number of Positions: 100, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA0113
Chip Quik Inc.

PA0113

part stock: 4736

Proto Board Type: SMD to DIP, Package Accepted: PQFP, TQFP, Number of Positions: 64, Pitch: 0.031" (0.80mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA0182
Chip Quik Inc.

PA0182

part stock: 19887

Proto Board Type: SMD to DIP, Package Accepted: SSOP, Number of Positions: 16, Pitch: 0.025" (0.64mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
IPC0048
Chip Quik Inc.

IPC0048

part stock: 8163

Proto Board Type: SMD to DIP, Package Accepted: PowerSOIC, PSOP, HSOP, Number of Positions: 24, Pitch: 0.039" (1.00mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
DR050D254P020
Chip Quik Inc.

DR050D254P020

part stock: 15322

Proto Board Type: SMD to DIP, Package Accepted: 0.5mm Connector, Number of Positions: 20, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
F127T254P16
Chip Quik Inc.

F127T254P16

part stock: 24587

Proto Board Type: Plated Through Hole to Plated Through Hole, Number of Positions: 16, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,

To Wishlist
PA0093
Chip Quik Inc.

PA0093

part stock: 7062

Proto Board Type: SMD to DIP, Package Accepted: LQFP, PQFP, TQFP, VQFP, Number of Positions: 44, Pitch: 0.031" (0.80mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
DC2010J-10X
Chip Quik Inc.

DC2010J-10X

part stock: 426

Proto Board Type: SMD to Plated Through Hole, Package Accepted: 2010, Number of Positions: 2, Pitch: 0.185" (4.70mm), Material: FR4 Epoxy Glass,

To Wishlist
PA0019
Chip Quik Inc.

PA0019

part stock: 13907

Proto Board Type: SMD to DIP, Package Accepted: SSOP, Number of Positions: 24, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
IPC0012
Chip Quik Inc.

IPC0012

part stock: 8821

Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 20, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
DC2512J-10X
Chip Quik Inc.

DC2512J-10X

part stock: 548

Proto Board Type: SMD to Plated Through Hole, Package Accepted: 2512, Number of Positions: 2, Pitch: 0.240" (6.10mm), Material: FR4 Epoxy Glass,

To Wishlist
DC1813J-10X
Chip Quik Inc.

DC1813J-10X

part stock: 595

Proto Board Type: SMD to Plated Through Hole, Package Accepted: 1813, Number of Positions: 2, Pitch: 0.161" (4.09mm), Material: FR4 Epoxy Glass,

To Wishlist
PA0195
Chip Quik Inc.

PA0195

part stock: 10707

Proto Board Type: SMD to DIP, Package Accepted: TSSOP, Number of Positions: 28, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
CN0006
Chip Quik Inc.

CN0006

part stock: 13905

Proto Board Type: Connector to SIP, Package Accepted: USB - A, Number of Positions: 4, Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
FPC050P050
Chip Quik Inc.

FPC050P050

part stock: 9354

Proto Board Type: SMD to DIP, Package Accepted: FPC Connector, Number of Positions: 50, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
DC2413J-10X
Chip Quik Inc.

DC2413J-10X

part stock: 597

Proto Board Type: SMD to Plated Through Hole, Package Accepted: 2413, Number of Positions: 2, Pitch: 0.191" (4.85mm), Material: FR4 Epoxy Glass,

To Wishlist
IPC0036
Chip Quik Inc.

IPC0036

part stock: 12689

Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 10, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA0091
Chip Quik Inc.

PA0091

part stock: 9947

Proto Board Type: SMD to DIP, Package Accepted: LQFP, TQFP, Number of Positions: 32, Pitch: 0.031" (0.80mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
DC1210J-10X
Chip Quik Inc.

DC1210J-10X

part stock: 632

Proto Board Type: SMD to Plated Through Hole, Package Accepted: 1210, Number of Positions: 2, Pitch: 0.118" (3.00mm), Material: FR4 Epoxy Glass,

To Wishlist
PA0064
Chip Quik Inc.

PA0064

part stock: 12719

Proto Board Type: SMD to DIP, Package Accepted: QFN THIN, Number of Positions: 24, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
F127T254P20
Chip Quik Inc.

F127T254P20

part stock: 21680

Proto Board Type: Plated Through Hole to Plated Through Hole, Number of Positions: 20, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,

To Wishlist
IPC0096
Chip Quik Inc.

IPC0096

part stock: 11683

Proto Board Type: SMD to DIP, Package Accepted: LGA, Number of Positions: 12, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
IPC0020
Chip Quik Inc.

IPC0020

part stock: 7026

Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 32, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
CN0073
Chip Quik Inc.

CN0073

part stock: 584

Proto Board Type: Connector to DIP, Package Accepted: USB - C, Number of Positions: 24, Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA0067
Chip Quik Inc.

PA0067

part stock: 8806

Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 32, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA0186
Chip Quik Inc.

PA0186

part stock: 13917

Proto Board Type: SMD to DIP, Package Accepted: TO-263 (DDPAK/D2PAK), Number of Positions: 7, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PCB3006-1
Chip Quik Inc.

PCB3006-1

part stock: 17571

Proto Board Type: SMD to PGA, Package Accepted: QFP, Number of Positions: 48, 64, 80, 100, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA-SOTD3SM18-06
Logical Systems Inc.

PA-SOTD3SM18-06

part stock: 14718

Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 6, Pitch: 0.037" (0.95mm),

To Wishlist
PA-SOD3SM18-28
Logical Systems Inc.

PA-SOD3SM18-28

part stock: 5254

Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 28, Pitch: 0.050" (1.27mm), Board Thickness: 0.031" (0.79mm) 1/32",

To Wishlist
PA-MSD3SM18-10
Logical Systems Inc.

PA-MSD3SM18-10

part stock: 14718

Proto Board Type: SMD to DIP, Package Accepted: MSOP, Number of Positions: 10, Pitch: 0.020" (0.50mm),

To Wishlist
LCQT-SOIC20W
Aries Electronics

LCQT-SOIC20W

part stock: 13573

Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 20, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
US-1008
Capital Advanced Technologies

US-1008

part stock: 68460

Proto Board Type: Through Hole to SIP, Package Accepted: Non Specific, Number of Positions: 8, Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,

To Wishlist