Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 8, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: LGA, Number of Positions: 16, Pitch: 0.039" (1.00mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: TSOP, Number of Positions: 32, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 48, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: TSOP, Number of Positions: 50, Pitch: 0.031" (0.80mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: CSP, Number of Positions: 28, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 12, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: FPC Connector, Number of Positions: 40, Pitch: 0.039" (1.00mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: LLP, Number of Positions: 48, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: LGA, Number of Positions: 28, Pitch: 0.022" (0.55mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: DFN, Number of Positions: 12, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: CSP, TCSP, Number of Positions: 32, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: MicroSMD, BGA, Number of Positions: 8, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: TSOP, Number of Positions: 56, Pitch: 0.031" (0.80mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: DFN, Number of Positions: 6, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: PowerSSO, Number of Positions: 28, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: FPC Connector, Number of Positions: 70, Pitch: 0.016" (0.40mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: FPC Connector, Number of Positions: 30, Pitch: 0.031" (0.80mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: FPC Connector, Number of Positions: 50, Pitch: 0.016" (0.40mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: HSOP, Number of Positions: 30, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 44, Pitch: 0.031" (0.80mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Package Accepted: PQFP, QFP, RQFP, Number of Positions: 208, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 32, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: TQFP, Number of Positions: 128, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: TSSOP, Number of Positions: 64, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: TSOP, Number of Positions: 32, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 28, Pitch: 0.018" (0.45mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: DFN, Number of Positions: 5, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: LLP, Number of Positions: 14, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SOT-666, Number of Positions: 6, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: TO-263 (DDPAK/D2PAK), Number of Positions: 9, Pitch: 0.038" (0.97mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: LLP, Number of Positions: 44, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: MiniSOIC EP, Number of Positions: 8, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: LQFP, Number of Positions: 40, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 24, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
