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Adapter, Breakout Boards

LCQT-QFP0.8-44
Aries Electronics

LCQT-QFP0.8-44

part stock: 7670

Proto Board Type: SMD to DIP, Package Accepted: QFP, Number of Positions: 44, Pitch: 0.031" (0.80mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
LCQT-SOIC32W
Aries Electronics

LCQT-SOIC32W

part stock: 10246

Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 32, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
LCQT-QFP0.65-64
Aries Electronics

LCQT-QFP0.65-64

part stock: 8254

Proto Board Type: SMD to DIP, Package Accepted: QFP, Number of Positions: 64, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
LCQT-SSOP20
Aries Electronics

LCQT-SSOP20

part stock: 13544

Proto Board Type: SMD to DIP, Package Accepted: SSOP, Number of Positions: 20, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA-TQFP-BB001-1
Chip Quik Inc.

PA-TQFP-BB001-1

part stock: 4999

Proto Board Type: SMD to PGA, Package Accepted: TQFP, Number of Positions: 48, 64, 80, 100, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
DC1210S-10X
Chip Quik Inc.

DC1210S-10X

part stock: 14970

Proto Board Type: SMD to DIP, Package Accepted: 1210, Number of Positions: 2, Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,

To Wishlist
F200T254P16
Chip Quik Inc.

F200T254P16

part stock: 24575

Proto Board Type: Plated Through Hole to Plated Through Hole, Number of Positions: 16, Pitch: 0.079" (2.00mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,

To Wishlist
CN0020
Chip Quik Inc.

CN0020

part stock: 13888

Proto Board Type: Connector to SIP, Package Accepted: 2.5mm ID, 5.5mm OD Plug, Number of Positions: 3, Pitch: 0.098" (2.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA0065
Chip Quik Inc.

PA0065

part stock: 9988

Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 28, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
DR050D254P040
Chip Quik Inc.

DR050D254P040

part stock: 10726

Proto Board Type: SMD to DIP, Package Accepted: 0.5mm Connector, Number of Positions: 40, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA0219SOCKET
Chip Quik Inc.

PA0219SOCKET

part stock: 3587

Proto Board Type: SMD to DIP, Package Accepted: LCC, JLCC, PLCC, Number of Positions: 52, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
CN0036
Chip Quik Inc.

CN0036

part stock: 3004

Proto Board Type: Connector to DIP, Package Accepted: Header, Number of Positions: 120, Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
IPC0107
Chip Quik Inc.

IPC0107

part stock: 8238

Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 24, Pitch: 0.016" (0.40mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
DC1210T-10X
Chip Quik Inc.

DC1210T-10X

part stock: 14954

Proto Board Type: SMD to DIP, Package Accepted: 1210, Number of Positions: 2, Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,

To Wishlist
DC1813T-10X
Chip Quik Inc.

DC1813T-10X

part stock: 14996

Proto Board Type: SMD to DIP, Package Accepted: 1813, Number of Positions: 2, Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,

To Wishlist
DC1206S-10X
Chip Quik Inc.

DC1206S-10X

part stock: 14966

Proto Board Type: SMD to DIP, Package Accepted: 1206, Number of Positions: 2, Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,

To Wishlist
DR254D254P10M
Chip Quik Inc.

DR254D254P10M

part stock: 11671

Proto Board Type: Connector to DIP, Package Accepted: 2.54mm Header, Number of Positions: 10, Pitch: 0.100" (2.54mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
DR127D254P40M
Chip Quik Inc.

DR127D254P40M

part stock: 3617

Proto Board Type: Connector to DIP, Package Accepted: 1.27mm Header, Number of Positions: 40, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA0106SOCKET
Chip Quik Inc.

PA0106SOCKET

part stock: 4422

Proto Board Type: SMD to DIP, Package Accepted: LCC, JLCC, PLCC, Number of Positions: 28, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
DR127D254P40F
Chip Quik Inc.

DR127D254P40F

part stock: 3654

Proto Board Type: Connector to DIP, Package Accepted: 1.27mm Header, Number of Positions: 40, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
CN0072
Chip Quik Inc.

CN0072

part stock: 236

Proto Board Type: Connector to Plated Through Hole, Number of Positions: 200, Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
IPC0072
Chip Quik Inc.

IPC0072

part stock: 10690

Proto Board Type: SMD to DIP, Package Accepted: DFN, Number of Positions: 14, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA0190
Chip Quik Inc.

PA0190

part stock: 4884

Proto Board Type: SMD to PGA, Package Accepted: TQFP, Number of Positions: 128, Pitch: 0.016" (0.40mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA0189
Chip Quik Inc.

PA0189

part stock: 4553

Proto Board Type: SMD to PGA, Package Accepted: LQFP, Number of Positions: 176, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
DR127D254P20F
Chip Quik Inc.

DR127D254P20F

part stock: 7406

Proto Board Type: Connector to DIP, Package Accepted: 1.27mm Header, Number of Positions: 20, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA0017
Chip Quik Inc.

PA0017

part stock: 17972

Proto Board Type: SMD to DIP, Package Accepted: SSOP, Number of Positions: 16, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
DR200D254P20F
Chip Quik Inc.

DR200D254P20F

part stock: 7752

Proto Board Type: Connector to DIP, Package Accepted: 2.00mm Header, Number of Positions: 20, Pitch: 0.079" (2.00mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA0210
Chip Quik Inc.

PA0210

part stock: 7760

Proto Board Type: SMD to DIP, Package Accepted: TSOP, Number of Positions: 54, Pitch: 0.031" (0.80mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
DR127D254P20M
Chip Quik Inc.

DR127D254P20M

part stock: 7333

Proto Board Type: Connector to DIP, Package Accepted: 1.27mm Header, Number of Positions: 20, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA-QSD3SM18-16
Logical Systems Inc.

PA-QSD3SM18-16

part stock: 9199

Proto Board Type: SMD to DIP, Package Accepted: QSOP, Number of Positions: 16, Pitch: 0.025" (0.64mm),

To Wishlist
PA-SSD6SM18-24
Logical Systems Inc.

PA-SSD6SM18-24

part stock: 6123

Proto Board Type: SMD to DIP, Package Accepted: SSOP, TSSOP, Number of Positions: 24, Pitch: 0.026" (0.65mm),

To Wishlist
TOL-11468
SparkFun Electronics

TOL-11468

part stock: 7426

Proto Board Type: Connector to Plated Through Hole, Package Accepted: SD Card, Number of Positions: 11,

To Wishlist
US-5014
Capital Advanced Technologies

US-5014

part stock: 25021

Proto Board Type: Through Hole to SIP, Package Accepted: Non Specific, Number of Positions: 14, Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,

To Wishlist
US-1010
Capital Advanced Technologies

US-1010

part stock: 56822

Proto Board Type: Through Hole to SIP, Package Accepted: Non Specific, Number of Positions: 10, Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,

To Wishlist
US-5008
Capital Advanced Technologies

US-5008

part stock: 39849

Proto Board Type: Through Hole to SIP, Package Accepted: Non Specific, Number of Positions: 8, Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,

To Wishlist
US-3012
Capital Advanced Technologies

US-3012

part stock: 32287

Proto Board Type: Through Hole to SIP, Package Accepted: Non Specific, Number of Positions: 12, Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,

To Wishlist