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Adapter, Breakout Boards

DC0402S-10X
Chip Quik Inc.

DC0402S-10X

part stock: 14949

Proto Board Type: SMD to DIP, Package Accepted: 0402, Number of Positions: 2, Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,

To Wishlist
PA0071
Chip Quik Inc.

PA0071

part stock: 7042

Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 40, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
IPC0103
Chip Quik Inc.

IPC0103

part stock: 12710

Proto Board Type: SMD to DIP, Package Accepted: LGA, Number of Positions: 10, Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
F200T254P08
Chip Quik Inc.

F200T254P08

part stock: 43355

Proto Board Type: Plated Through Hole to Plated Through Hole, Number of Positions: 8, Pitch: 0.079" (2.00mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,

To Wishlist
PA0016
Chip Quik Inc.

PA0016

part stock: 17943

Proto Board Type: SMD to DIP, Package Accepted: SSOP, Number of Positions: 14, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA0092
Chip Quik Inc.

PA0092

part stock: 8781

Proto Board Type: SMD to DIP, Package Accepted: TQFP, Number of Positions: 32, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
DC0805J-10X
Chip Quik Inc.

DC0805J-10X

part stock: 337

Proto Board Type: SMD to Plated Through Hole, Package Accepted: 0805, Number of Positions: 2, Pitch: 0.078" (1.98mm), Material: FR4 Epoxy Glass,

To Wishlist
CN0035
Chip Quik Inc.

CN0035

part stock: 13917

Proto Board Type: Connector to SIP, Package Accepted: RJ45, Ethernet Plug, Number of Positions: 8, Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA0062
Chip Quik Inc.

PA0062

part stock: 15369

Proto Board Type: SMD to DIP, Package Accepted: QFN, Number of Positions: 16, Pitch: 0.031" (0.80mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
DC0402J-10X
Chip Quik Inc.

DC0402J-10X

part stock: 308

Proto Board Type: SMD to Plated Through Hole, Package Accepted: 0402, Number of Positions: 2, Pitch: 0.036" (0.91mm), Material: FR4 Epoxy Glass,

To Wishlist
CN0007
Chip Quik Inc.

CN0007

part stock: 13878

Proto Board Type: Connector to SIP, Package Accepted: USB - B, Number of Positions: 4, Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA0094
Chip Quik Inc.

PA0094

part stock: 5390

Proto Board Type: SMD to DIP, Package Accepted: LQFP, TQFP, Number of Positions: 48, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA0107SOCKET
Chip Quik Inc.

PA0107SOCKET

part stock: 3715

Proto Board Type: SMD to DIP, Package Accepted: LCC, JLCC, PLCC, Number of Positions: 44, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA0188
Chip Quik Inc.

PA0188

part stock: 4838

Proto Board Type: SMD to PGA, Package Accepted: LQFP, Number of Positions: 144, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA0049
Chip Quik Inc.

PA0049

part stock: 23000

Proto Board Type: SMD to DIP, Package Accepted: DFN, MLP, Number of Positions: 6, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
CN0030
Chip Quik Inc.

CN0030

part stock: 13871

Proto Board Type: Connector to SIP, Package Accepted: DB9, Number of Positions: 9, Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
PA0194
Chip Quik Inc.

PA0194

part stock: 12726

Proto Board Type: SMD to DIP, Package Accepted: TSSOP, Number of Positions: 20, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
DC0603J-10X
Chip Quik Inc.

DC0603J-10X

part stock: 418

Proto Board Type: SMD to Plated Through Hole, Package Accepted: 0603, Number of Positions: 2, Pitch: 0.063" (1.60mm), Material: FR4 Epoxy Glass,

To Wishlist
FPC100P030
Chip Quik Inc.

FPC100P030

part stock: 12716

Proto Board Type: SMD to DIP, Package Accepted: FPC Connector, Number of Positions: 30, Pitch: 0.039" (1.00mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
DR127D254P10M
Chip Quik Inc.

DR127D254P10M

part stock: 9927

Proto Board Type: Connector to DIP, Package Accepted: 1.27mm Header, Number of Positions: 10, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
F200T254P20
Chip Quik Inc.

F200T254P20

part stock: 21636

Proto Board Type: Plated Through Hole to Plated Through Hole, Number of Positions: 20, Pitch: 0.079" (2.00mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,

To Wishlist
PA0018
Chip Quik Inc.

PA0018

part stock: 15342

Proto Board Type: SMD to DIP, Package Accepted: SSOP, Number of Positions: 20, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
CN0009
Chip Quik Inc.

CN0009

part stock: 13896

Proto Board Type: Connector to SIP, Package Accepted: USB - micro B, Number of Positions: 5, Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
US-2010
Capital Advanced Technologies

US-2010

part stock: 48586

Proto Board Type: Through Hole to SIP, Package Accepted: Non Specific, Number of Positions: 10, Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,

To Wishlist
US-5020
Capital Advanced Technologies

US-5020

part stock: 18227

Proto Board Type: Through Hole to SIP, Package Accepted: Non Specific, Number of Positions: 20, Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,

To Wishlist
US-2006
Capital Advanced Technologies

US-2006

part stock: 76377

Proto Board Type: Through Hole to SIP, Package Accepted: Non Specific, Number of Positions: 6, Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,

To Wishlist
US-4010
Capital Advanced Technologies

US-4010

part stock: 37813

Proto Board Type: Through Hole to SIP, Package Accepted: Non Specific, Number of Positions: 10, Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,

To Wishlist
US-3010
Capital Advanced Technologies

US-3010

part stock: 37807

Proto Board Type: Through Hole to SIP, Package Accepted: Non Specific, Number of Positions: 10, Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,

To Wishlist
US-4012
Capital Advanced Technologies

US-4012

part stock: 32326

Proto Board Type: Through Hole to SIP, Package Accepted: Non Specific, Number of Positions: 12, Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,

To Wishlist
US-3014
Capital Advanced Technologies

US-3014

part stock: 28206

Proto Board Type: Through Hole to SIP, Package Accepted: Non Specific, Number of Positions: 14, Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,

To Wishlist
US-2012
Capital Advanced Technologies

US-2012

part stock: 42410

Proto Board Type: Through Hole to SIP, Package Accepted: Non Specific, Number of Positions: 12, Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,

To Wishlist
PA-SSD3SM18-28
Logical Systems Inc.

PA-SSD3SM18-28

part stock: 5244

Proto Board Type: SMD to DIP, Package Accepted: SSOP, TSSOP, Number of Positions: 28, Pitch: 0.026" (0.65mm),

To Wishlist
PA-SSD3SM18-08
Logical Systems Inc.

PA-SSD3SM18-08

part stock: 14682

Proto Board Type: SMD to DIP, Package Accepted: SSOP, TSSOP, Number of Positions: 8, Pitch: 0.026" (0.65mm),

To Wishlist
LCQT-TSOP32-1
Aries Electronics

LCQT-TSOP32-1

part stock: 10145

Proto Board Type: SMD to DIP, Package Accepted: TSOP, Number of Positions: 32, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
LCQT-QFP0.5-64
Aries Electronics

LCQT-QFP0.5-64

part stock: 8189

Proto Board Type: SMD to DIP, Package Accepted: QFP, Number of Positions: 64, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist
LCQT-SOIC14W
Aries Electronics

LCQT-SOIC14W

part stock: 17982

Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 14, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,

To Wishlist