Sockets for ICs, Transistors | Connectors, Interconnects | 100

33-0518-11

part stock: 16256

Type: SIP, Number of Positions or Pins (Grid): 33 (1 x 33), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

30-6511-10

part stock: 16352

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 30 (2 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

30-6513-10

part stock: 16351

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 30 (2 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

32-3513-10T

part stock: 16701

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

32-0518-11

part stock: 16710

Type: SIP, Number of Positions or Pins (Grid): 32 (1 x 32), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

32-1518-11

part stock: 16876

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

39-0518-10H

part stock: 16925

Type: SIP, Number of Positions or Pins (Grid): 39 (1 x 39), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

32-6513-10T

part stock: 16995

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

31-0518-11

part stock: 17295

Type: SIP, Number of Positions or Pins (Grid): 31 (1 x 31), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

38-1518-10H

part stock: 17347

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 38 (2 x 19), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

38-0518-10H

part stock: 17316

Type: SIP, Number of Positions or Pins (Grid): 38 (1 x 38), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

30-3513-10T

part stock: 17714

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 30 (2 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

37-0518-10H

part stock: 17861

Type: SIP, Number of Positions or Pins (Grid): 37 (1 x 37), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

30-0518-11

part stock: 17809

Type: SIP, Number of Positions or Pins (Grid): 30 (1 x 30), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

30-1518-11

part stock: 17948

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 30 (2 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

30-6513-10T

part stock: 18179

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 30 (2 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

36-1518-10H

part stock: 18194

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

36-0518-10H

part stock: 18249

Type: SIP, Number of Positions or Pins (Grid): 36 (1 x 36), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

39-0518-10T

part stock: 18451

Type: SIP, Number of Positions or Pins (Grid): 39 (1 x 39), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

32-6518-00

part stock: 18464

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

35-0518-10H

part stock: 18785

Type: SIP, Number of Positions or Pins (Grid): 35 (1 x 35), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

38-0518-10T

part stock: 18871

Type: SIP, Number of Positions or Pins (Grid): 38 (1 x 38), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

38-1518-10T

part stock: 18979

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 38 (2 x 19), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

34-0518-10H

part stock: 19322

Type: SIP, Number of Positions or Pins (Grid): 34 (1 x 34), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

34-1518-10H

part stock: 19292

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 34 (2 x 17), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

37-0518-10T

part stock: 19401

Type: SIP, Number of Positions or Pins (Grid): 37 (1 x 37), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

34-3513-10

part stock: 19743

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 34 (2 x 17), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

33-0518-10H

part stock: 19874

Type: SIP, Number of Positions or Pins (Grid): 33 (1 x 33), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

36-0518-10T

part stock: 19936

Type: SIP, Number of Positions or Pins (Grid): 36 (1 x 36), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

36-1518-10T

part stock: 19984

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

39-0518-10

part stock: 20012

Type: SIP, Number of Positions or Pins (Grid): 39 (1 x 39), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

32-1518-10H

part stock: 20422

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

32-0518-10H

part stock: 20376

Type: SIP, Number of Positions or Pins (Grid): 32 (1 x 32), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

38-0518-10

part stock: 20498

Type: SIP, Number of Positions or Pins (Grid): 38 (1 x 38), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

35-0518-10T

part stock: 20524

Type: SIP, Number of Positions or Pins (Grid): 35 (1 x 35), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

38-1518-10

part stock: 20626

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 38 (2 x 19), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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