Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 8, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 14, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 16, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Number of Positions: 10, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 18, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Number of Positions: 12, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SSOP, Number of Positions: 14, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SSOP, Number of Positions: 16, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16",
Proto Board Type: SMD to SMD, Package Accepted: SOIC, Number of Positions: 16, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SSOP, Number of Positions: 14, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16",
Proto Board Type: SMD to DIP, Package Accepted: SSOP, Number of Positions: 16, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SOT, Number of Positions: 6, Pitch: 0.037" (0.95mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 8, Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SSOP, Number of Positions: 20, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16",
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 28, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Package Accepted: PLCC, Number of Positions: 28, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 20, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Number of Positions: 22, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SSOP, Number of Positions: 28, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 24, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
