Sockets for ICs, Transistors | Connectors, Interconnects | 100

34-0518-11H

part stock: 9754

Type: SIP, Number of Positions or Pins (Grid): 34 (1 x 34), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

34-1518-11H

part stock: 9775

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 34 (2 x 17), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

37-0511-10

part stock: 9784

Type: SIP, Number of Positions or Pins (Grid): 37 (1 x 37), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

32-6518-112

part stock: 9745

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

36-0511-10

part stock: 9893

Type: SIP, Number of Positions or Pins (Grid): 36 (1 x 36), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

35-0518-11H

part stock: 9873

Type: SIP, Number of Positions or Pins (Grid): 35 (1 x 35), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

38-1518-00

part stock: 9879

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 38 (2 x 19), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

38-0518-00

part stock: 9955

Type: SIP, Number of Positions or Pins (Grid): 38 (1 x 38), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

39-0511-10

part stock: 9890

Type: SIP, Number of Positions or Pins (Grid): 39 (1 x 39), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

33-0518-11H

part stock: 9970

Type: SIP, Number of Positions or Pins (Grid): 33 (1 x 33), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

35-0511-10

part stock: 10015

Type: SIP, Number of Positions or Pins (Grid): 35 (1 x 35), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

36-6513-11

part stock: 10089

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

32-C182-10

part stock: 10067

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

37-0518-00

part stock: 10266

Type: SIP, Number of Positions or Pins (Grid): 37 (1 x 37), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

32-1518-11H

part stock: 10250

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

33-0511-10

part stock: 10281

Type: SIP, Number of Positions or Pins (Grid): 33 (1 x 33), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

32-0518-11H

part stock: 10244

Type: SIP, Number of Positions or Pins (Grid): 32 (1 x 32), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

32-6518-111

part stock: 10320

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

32-0511-10

part stock: 10439

Type: SIP, Number of Positions or Pins (Grid): 32 (1 x 32), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

36-0518-00

part stock: 10438

Type: SIP, Number of Positions or Pins (Grid): 36 (1 x 36), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

36-1518-00

part stock: 10511

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

31-0511-10

part stock: 10582

Type: SIP, Number of Positions or Pins (Grid): 31 (1 x 31), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

31-0518-11H

part stock: 10583

Type: SIP, Number of Positions or Pins (Grid): 31 (1 x 31), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

30-0511-10

part stock: 10744

Type: SIP, Number of Positions or Pins (Grid): 30 (1 x 30), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

35-0518-00

part stock: 10815

Type: SIP, Number of Positions or Pins (Grid): 35 (1 x 35), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

30-0518-11H

part stock: 10984

Type: SIP, Number of Positions or Pins (Grid): 30 (1 x 30), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

30-1518-11H

part stock: 10976

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 30 (2 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

34-1518-00

part stock: 11166

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 34 (2 x 17), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

34-0518-00

part stock: 11109

Type: SIP, Number of Positions or Pins (Grid): 34 (1 x 34), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

33-0518-00

part stock: 11466

Type: SIP, Number of Positions or Pins (Grid): 33 (1 x 33), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

32-1518-00

part stock: 11848

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

32-0518-00

part stock: 11901

Type: SIP, Number of Positions or Pins (Grid): 32 (1 x 32), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

32-C212-10

part stock: 11961

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

32-C300-10

part stock: 11971

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

34-0511-10

part stock: 11950

Type: SIP, Number of Positions or Pins (Grid): 34 (1 x 34), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

32-6518-102

part stock: 12068

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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