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Sockets for ICs, Transistors

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34-71130-10
Aries Electronics

34-71130-10

part stock: 5701

Type: SIP, Number of Positions or Pins (Grid): 34 (1 x 34), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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34-7350-10
Aries Electronics

34-7350-10

part stock: 5748

Type: SIP, Number of Positions or Pins (Grid): 34 (1 x 34), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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34-7550-10
Aries Electronics

34-7550-10

part stock: 5779

Type: SIP, Number of Positions or Pins (Grid): 34 (1 x 34), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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36-6501-31
Aries Electronics

36-6501-31

part stock: 5763

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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36-6501-21
Aries Electronics

36-6501-21

part stock: 5730

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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30-9513-11H
Aries Electronics

30-9513-11H

part stock: 5762

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 30 (2 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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39-0508-30
Aries Electronics

39-0508-30

part stock: 5803

Type: SIP, Number of Positions or Pins (Grid): 39 (1 x 39), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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39-0508-20
Aries Electronics

39-0508-20

part stock: 5787

Type: SIP, Number of Positions or Pins (Grid): 39 (1 x 39), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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32-6501-21
Aries Electronics

32-6501-21

part stock: 5835

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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32-6501-31
Aries Electronics

32-6501-31

part stock: 5747

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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36-6554-10
Aries Electronics

36-6554-10

part stock: 5812

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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36-3552-10
Aries Electronics

36-3552-10

part stock: 5833

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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36-3554-10
Aries Electronics

36-3554-10

part stock: 5833

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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36-3513-11H
Aries Electronics

36-3513-11H

part stock: 5812

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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30-6823-90T
Aries Electronics

30-6823-90T

part stock: 5856

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 30 (2 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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38-6511-11
Aries Electronics

38-6511-11

part stock: 5890

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 38 (2 x 19), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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36-3503-30
Aries Electronics

36-3503-30

part stock: 5857

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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36-3503-20
Aries Electronics

36-3503-20

part stock: 5927

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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32-6508-301
Aries Electronics

32-6508-301

part stock: 5921

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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30-9503-20
Aries Electronics

30-9503-20

part stock: 5908

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 30 (2 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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32-6508-201
Aries Electronics

32-6508-201

part stock: 5960

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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30-9503-30
Aries Electronics

30-9503-30

part stock: 5905

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 30 (2 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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38-0508-20
Aries Electronics

38-0508-20

part stock: 5959

Type: SIP, Number of Positions or Pins (Grid): 38 (1 x 38), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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38-0508-30
Aries Electronics

38-0508-30

part stock: 5965

Type: SIP, Number of Positions or Pins (Grid): 38 (1 x 38), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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38-1508-20
Aries Electronics

38-1508-20

part stock: 5880

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 38 (2 x 19), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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38-1508-30
Aries Electronics

38-1508-30

part stock: 5937

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 38 (2 x 19), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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30-6820-90C
Aries Electronics

30-6820-90C

part stock: 6044

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 30 (2 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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30-6823-90C
Aries Electronics

30-6823-90C

part stock: 6032

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 30 (2 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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30-6822-90C
Aries Electronics

30-6822-90C

part stock: 6003

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 30 (2 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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32-6554-10
Aries Electronics

32-6554-10

part stock: 6048

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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36-6503-30
Aries Electronics

36-6503-30

part stock: 6033

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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36-6503-20
Aries Electronics

36-6503-20

part stock: 6013

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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37-0508-20
Aries Electronics

37-0508-20

part stock: 6058

Type: SIP, Number of Positions or Pins (Grid): 37 (1 x 37), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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37-0508-30
Aries Electronics

37-0508-30

part stock: 6085

Type: SIP, Number of Positions or Pins (Grid): 37 (1 x 37), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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32-6553-11
Aries Electronics

32-6553-11

part stock: 6129

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Copper,

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36-6511-11
Aries Electronics

36-6511-11

part stock: 6073

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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