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Sockets for ICs, Transistors

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32-6508-202
Aries Electronics

32-6508-202

part stock: 5550

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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30-0501-30
Aries Electronics

30-0501-30

part stock: 5539

Type: SIP, Number of Positions or Pins (Grid): 30 (1 x 30), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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32-6508-302
Aries Electronics

32-6508-302

part stock: 5556

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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30-0501-20
Aries Electronics

30-0501-20

part stock: 5574

Type: SIP, Number of Positions or Pins (Grid): 30 (1 x 30), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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38-3503-20
Aries Electronics

38-3503-20

part stock: 5629

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 38 (2 x 19), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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38-3503-30
Aries Electronics

38-3503-30

part stock: 5596

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 38 (2 x 19), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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34-6823-90
Aries Electronics

34-6823-90

part stock: 5646

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 34 (2 x 17), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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32-9503-30
Aries Electronics

32-9503-30

part stock: 5644

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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32-9503-20
Aries Electronics

32-9503-20

part stock: 5659

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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36-0501-30
Aries Electronics

36-0501-30

part stock: 5699

Type: SIP, Number of Positions or Pins (Grid): 36 (1 x 36), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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36-0501-20
Aries Electronics

36-0501-20

part stock: 5664

Type: SIP, Number of Positions or Pins (Grid): 36 (1 x 36), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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34-3513-11H
Aries Electronics

34-3513-11H

part stock: 5632

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 34 (2 x 17), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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33-0501-30
Aries Electronics

33-0501-30

part stock: 5720

Type: SIP, Number of Positions or Pins (Grid): 33 (1 x 33), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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33-0501-20
Aries Electronics

33-0501-20

part stock: 5681

Type: SIP, Number of Positions or Pins (Grid): 33 (1 x 33), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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32-823-90C
Aries Electronics

32-823-90C

part stock: 5733

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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32-822-90C
Aries Electronics

32-822-90C

part stock: 5677

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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32-6820-90C
Aries Electronics

32-6820-90C

part stock: 5730

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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32-6822-90C
Aries Electronics

32-6822-90C

part stock: 5684

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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32-6823-90C
Aries Electronics

32-6823-90C

part stock: 5678

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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38-6823-90C
Aries Electronics

38-6823-90C

part stock: 5684

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 38 (2 x 19), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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38-6822-90C
Aries Electronics

38-6822-90C

part stock: 5711

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 38 (2 x 19), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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38-6820-90C
Aries Electronics

38-6820-90C

part stock: 5748

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 38 (2 x 19), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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34-7500-10
Aries Electronics

34-7500-10

part stock: 5736

Type: SIP, Number of Positions or Pins (Grid): 34 (1 x 34), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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34-7453-10
Aries Electronics

34-7453-10

part stock: 5772

Type: SIP, Number of Positions or Pins (Grid): 34 (1 x 34), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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34-7435-10
Aries Electronics

34-7435-10

part stock: 5740

Type: SIP, Number of Positions or Pins (Grid): 34 (1 x 34), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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34-7335-10
Aries Electronics

34-7335-10

part stock: 5704

Type: SIP, Number of Positions or Pins (Grid): 34 (1 x 34), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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34-7400-10
Aries Electronics

34-7400-10

part stock: 5717

Type: SIP, Number of Positions or Pins (Grid): 34 (1 x 34), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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34-71250-10
Aries Electronics

34-71250-10

part stock: 5764

Type: SIP, Number of Positions or Pins (Grid): 34 (1 x 34), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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34-7750-10
Aries Electronics

34-7750-10

part stock: 5687

Type: SIP, Number of Positions or Pins (Grid): 34 (1 x 34), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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34-7450-10
Aries Electronics

34-7450-10

part stock: 5730

Type: SIP, Number of Positions or Pins (Grid): 34 (1 x 34), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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34-7725-10
Aries Electronics

34-7725-10

part stock: 5717

Type: SIP, Number of Positions or Pins (Grid): 34 (1 x 34), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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34-7650-10
Aries Electronics

34-7650-10

part stock: 5727

Type: SIP, Number of Positions or Pins (Grid): 34 (1 x 34), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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34-7XXXX-10
Aries Electronics

34-7XXXX-10

part stock: 5713

Type: SIP, Number of Positions or Pins (Grid): 34 (1 x 34), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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34-7394-10
Aries Electronics

34-7394-10

part stock: 5769

Type: SIP, Number of Positions or Pins (Grid): 34 (1 x 34), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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35-7435-10
Aries Electronics

35-7435-10

part stock: 5777

Type: SIP, Number of Positions or Pins (Grid): 35 (1 x 35), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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34-71050-10
Aries Electronics

34-71050-10

part stock: 5777

Type: SIP, Number of Positions or Pins (Grid): 34 (1 x 34), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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