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Sockets for ICs, Transistors

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36-7XXXX-10
Aries Electronics

36-7XXXX-10

part stock: 5324

Type: SIP, Number of Positions or Pins (Grid): 36 (1 x 36), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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32-6556-30
Aries Electronics

32-6556-30

part stock: 5342

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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32-6556-20
Aries Electronics

32-6556-20

part stock: 5358

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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38-0501-30
Aries Electronics

38-0501-30

part stock: 5427

Type: SIP, Number of Positions or Pins (Grid): 38 (1 x 38), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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38-0501-20
Aries Electronics

38-0501-20

part stock: 5409

Type: SIP, Number of Positions or Pins (Grid): 38 (1 x 38), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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34-6823-90C
Aries Electronics

34-6823-90C

part stock: 5371

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 34 (2 x 17), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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34-6822-90C
Aries Electronics

34-6822-90C

part stock: 5403

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 34 (2 x 17), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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34-6820-90C
Aries Electronics

34-6820-90C

part stock: 5421

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 34 (2 x 17), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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36-6823-90
Aries Electronics

36-6823-90

part stock: 5375

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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37-PGM10012-11
Aries Electronics

37-PGM10012-11

part stock: 5447

Type: PGA, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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32-6574-10
Aries Electronics

32-6574-10

part stock: 5439

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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38-6501-31
Aries Electronics

38-6501-31

part stock: 5390

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 38 (2 x 19), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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38-6501-21
Aries Electronics

38-6501-21

part stock: 5447

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 38 (2 x 19), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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32-9513-11H
Aries Electronics

32-9513-11H

part stock: 5474

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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32-3574-10
Aries Electronics

32-3574-10

part stock: 5425

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Nickel,

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32-6508-20
Aries Electronics

32-6508-20

part stock: 5454

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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32-6508-30
Aries Electronics

32-6508-30

part stock: 5484

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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32-6552-11
Aries Electronics

32-6552-11

part stock: 5509

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

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32-3551-11
Aries Electronics

32-3551-11

part stock: 5453

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

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32-3552-11
Aries Electronics

32-3552-11

part stock: 5436

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

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32-6551-11
Aries Electronics

32-6551-11

part stock: 5482

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

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32-3553-11
Aries Electronics

32-3553-11

part stock: 5523

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

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36-6556-11
Aries Electronics

36-6556-11

part stock: 5485

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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31-0501-30
Aries Electronics

31-0501-30

part stock: 5512

Type: SIP, Number of Positions or Pins (Grid): 31 (1 x 31), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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31-0501-20
Aries Electronics

31-0501-20

part stock: 5475

Type: SIP, Number of Positions or Pins (Grid): 31 (1 x 31), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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35-71000-10
Aries Electronics

35-71000-10

part stock: 5525

Type: SIP, Number of Positions or Pins (Grid): 35 (1 x 35), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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35-7XXXX-10
Aries Electronics

35-7XXXX-10

part stock: 5497

Type: SIP, Number of Positions or Pins (Grid): 35 (1 x 35), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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35-7360-10
Aries Electronics

35-7360-10

part stock: 5526

Type: SIP, Number of Positions or Pins (Grid): 35 (1 x 35), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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30-8950-610C
Aries Electronics

30-8950-610C

part stock: 5472

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 30 (2 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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30-8940-310C
Aries Electronics

30-8940-310C

part stock: 5530

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 30 (2 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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30-81250-610C
Aries Electronics

30-81250-610C

part stock: 5505

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 30 (2 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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30-8563-610C
Aries Electronics

30-8563-610C

part stock: 5503

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 30 (2 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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37-0501-30
Aries Electronics

37-0501-30

part stock: 5491

Type: SIP, Number of Positions or Pins (Grid): 37 (1 x 37), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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37-0501-20
Aries Electronics

37-0501-20

part stock: 5558

Type: SIP, Number of Positions or Pins (Grid): 37 (1 x 37), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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30-6501-31
Aries Electronics

30-6501-31

part stock: 5544

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 30 (2 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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30-6501-21
Aries Electronics

30-6501-21

part stock: 5557

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 30 (2 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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