Sockets for ICs, Transistors

111-93-642-41-001000

part stock: 5142

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 42 (2 x 21), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

121-11-322-41-001000

part stock: 117

121-11-422-41-001000

part stock: 35

116-43-318-41-001000

part stock: 96

116-93-318-41-001000

part stock: 5112

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

104-11-624-41-780000

part stock: 105

104-11-324-41-780000

part stock: 114

104-11-424-41-780000

part stock: 80

124-43-314-41-002000

part stock: 116

126-91-316-41-002000

part stock: 122

124-93-314-41-002000

part stock: 5110

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 14 (2 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-41-316-41-002000

part stock: 81

110-43-650-41-001000

part stock: 40

110-93-650-41-001000

part stock: 5135

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 50 (2 x 25), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

104-13-318-41-780000

part stock: 5175

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

127-93-620-41-002000

part stock: 36

127-43-620-41-002000

part stock: 123

116-93-422-41-008000

part stock: 5121

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 22 (2 x 11), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-93-322-41-008000

part stock: 5180

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 22 (2 x 11), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-43-322-41-008000

part stock: 111

116-43-422-41-008000

part stock: 49

110-11-640-41-001000

part stock: 105

114-41-650-41-117000

part stock: 118

114-91-650-41-117000

part stock: 62

117-43-316-41-105000

part stock: 42

127-91-620-41-003000

part stock: 105

104-13-422-41-770000

part stock: 5125

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 22 (2 x 11), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

127-41-620-41-003000

part stock: 103

104-13-322-41-770000

part stock: 5196

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 22 (2 x 11), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-41-314-41-003000

part stock: 77

126-91-314-41-003000

part stock: 77

116-91-432-41-006000

part stock: 57

116-41-632-41-006000

part stock: 78

116-41-432-41-006000

part stock: 69

116-91-632-41-006000

part stock: 54

18-810-90WR

part stock: 5184

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,