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Sockets for ICs, Transistors

0804MC
Texas Instruments

0804MC

part stock: 2822

Type: Transistor, TO-3, Number of Positions or Pins (Grid): 8 (Oval), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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0475962032
Molex

0475962032

part stock: 5112

Type: LGA,

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0475960532
Molex

0475960532

part stock: 5073

Type: LGA, Number of Positions or Pins (Grid): 1156 (40 x 40), Pitch - Mating: 0.036" (0.91mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Copper Alloy,

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0475960233
Molex

0475960233

part stock: 4920

Type: LGA, Number of Positions or Pins (Grid): 1155 (40 x 40), Pitch - Mating: 0.036" (0.91mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Copper Alloy,

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0475960132
Molex

0475960132

part stock: 4902

Type: LGA, Number of Positions or Pins (Grid): 1156 (40 x 40), Pitch - Mating: 0.036" (0.91mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Copper Alloy,

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0475960232
Molex

0475960232

part stock: 4888

Type: LGA, Number of Positions or Pins (Grid): 1155 (40 x 40), Pitch - Mating: 0.036" (0.91mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Copper Alloy,

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0475943001
Molex

0475943001

part stock: 4895

Type: LGA, Number of Positions or Pins (Grid): 1356 (32 x 41), Pitch - Mating: 0.040" (1.02mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm),

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0475940002
Molex

0475940002

part stock: 4941

Type: LGA, Number of Positions or Pins (Grid): 1366 (32 x 41), Pitch - Mating: 0.040" (1.02mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Copper Alloy,

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0475940001
Molex

0475940001

part stock: 4876

Type: LGA, Number of Positions or Pins (Grid): 1366 (32 x 41), Pitch - Mating: 0.040" (1.02mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Copper Alloy,

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0475939000
Molex

0475939000

part stock: 8486

Type: LGA, Number of Positions or Pins (Grid): 1366 (32 x 41), Contact Finish - Mating: Nickel, Contact Finish Thickness - Mating: 3.00µin (0.076µm),

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0479890242
Molex

0479890242

part stock: 4857

Type: PGA, Number of Positions or Pins (Grid): 988 (35 x 36), Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Copper Alloy,

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0479890232
Molex

0479890232

part stock: 4855

Type: PGA, Number of Positions or Pins (Grid): 989 (35 x 36), Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Copper Alloy,

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0479890222
Molex

0479890222

part stock: 8547

Type: PGA, Number of Positions or Pins (Grid): 989 (35 x 36), Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Copper Alloy,

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0479890212
Molex

0479890212

part stock: 4830

Type: PGA, Number of Positions or Pins (Grid): 989 (35 x 36), Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Copper Alloy,

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0479890122
Molex

0479890122

part stock: 4801

Type: PGA, Number of Positions or Pins (Grid): 989 (35 x 36), Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Copper Alloy,

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0479890112
Molex

0479890112

part stock: 4816

Type: PGA, Number of Positions or Pins (Grid): 989 (35 x 36), Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Copper Alloy,

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0473370001
Molex

0473370001

part stock: 78033

Type: Camera Socket, Number of Positions or Pins (Grid): 24 (4 x 6), Pitch - Mating: 0.035" (0.90mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 12.0µin (0.30µm), Contact Material - Mating: Copper Alloy,

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0009483031
Molex

0009483031

part stock: 2307

Type: Transistor, TO-220, Number of Positions or Pins (Grid): 3 (Rectangular), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Brass,

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0784990002
Molex

0784990002

part stock: 74915

Type: Camera Socket, Number of Positions or Pins (Grid): 24 (2 x 4, 2 x 8), Pitch - Mating: 0.024" (0.60mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 12.0µin (0.30µm), Contact Material - Mating: Copper Alloy,

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0479890142
Molex

0479890142

part stock: 9725

Type: PGA, Number of Positions or Pins (Grid): 989 (35 x 36), Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Copper Alloy,

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0479890132
Molex

0479890132

part stock: 9761

Type: PGA, Number of Positions or Pins (Grid): 989 (35 x 36), Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Copper Alloy,

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08-6513-11H
Aries Electronics

08-6513-11H

part stock: 24471

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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02-0518-00
Aries Electronics

02-0518-00

part stock: 5561

Type: SIP, Number of Positions or Pins (Grid): 2 (1 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

To Wishlist
09-0511-11
Aries Electronics

09-0511-11

part stock: 7312

Type: SIP, Number of Positions or Pins (Grid): 9 (1 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

To Wishlist
06-0511-11
Aries Electronics

06-0511-11

part stock: 7391

Type: SIP, Number of Positions or Pins (Grid): 6 (1 x 6), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

To Wishlist
07-0511-11
Aries Electronics

07-0511-11

part stock: 7576

Type: SIP, Number of Positions or Pins (Grid): 7 (1 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

To Wishlist
05-0511-11
Aries Electronics

05-0511-11

part stock: 7750

Type: SIP, Number of Positions or Pins (Grid): 5 (1 x 5), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

To Wishlist
08-6621-30
Aries Electronics

08-6621-30

part stock: 8434

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

To Wishlist
03-0511-11
Aries Electronics

03-0511-11

part stock: 8714

Type: SIP, Number of Positions or Pins (Grid): 3 (1 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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09-7970-11
Aries Electronics

09-7970-11

part stock: 8875

Type: SIP, Number of Positions or Pins (Grid): 9 (1 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

To Wishlist
09-7510-10
Aries Electronics

09-7510-10

part stock: 8965

Type: SIP, Number of Positions or Pins (Grid): 9 (1 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

To Wishlist
09-7380-10
Aries Electronics

09-7380-10

part stock: 9024

Type: SIP, Number of Positions or Pins (Grid): 9 (1 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

To Wishlist
09-7500-10
Aries Electronics

09-7500-10

part stock: 9014

Type: SIP, Number of Positions or Pins (Grid): 9 (1 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

To Wishlist
09-71000-10
Aries Electronics

09-71000-10

part stock: 9009

Type: SIP, Number of Positions or Pins (Grid): 9 (1 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

To Wishlist
09-7970-10
Aries Electronics

09-7970-10

part stock: 8993

Type: SIP, Number of Positions or Pins (Grid): 9 (1 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

To Wishlist
09-7420-10
Aries Electronics

09-7420-10

part stock: 8969

Type: SIP, Number of Positions or Pins (Grid): 9 (1 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

To Wishlist