Sockets for ICs, Transistors

144-PGM13095-10

part stock: 4956

Type: PGA, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

18-3508-31

part stock: 5040

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

18-3508-21

part stock: 5059

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

121-11-424-41-001000

part stock: 56

146-43-632-41-012000

part stock: 67

121-11-324-41-001000

part stock: 29

121-11-624-41-001000

part stock: 51

146-93-632-41-012000

part stock: 5005

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-41-320-41-002000

part stock: 86

126-91-420-41-002000

part stock: 109

126-41-420-41-002000

part stock: 90

126-91-320-41-002000

part stock: 68

115-91-952-41-001000

part stock: 79

115-41-952-41-001000

part stock: 101

110-44-318-61-001000

part stock: 84

126-43-314-41-003000

part stock: 109

126-93-314-41-003000

part stock: 5001

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 14 (2 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-93-318-41-001000

part stock: 4974

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-43-318-41-001000

part stock: 28

110-99-318-61-001000

part stock: 34

115-93-648-41-001000

part stock: 5056

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 48 (2 x 24), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

110-44-320-61-001000

part stock: 122

115-43-648-41-001000

part stock: 125

110-41-314-61-001000

part stock: 89

110-91-314-61-001000

part stock: 37

114-43-642-41-117000

part stock: 71

114-93-642-41-117000

part stock: 5023

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 42 (2 x 21), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-43-324-41-008000

part stock: 121

110-99-320-61-001000

part stock: 26

116-43-624-41-008000

part stock: 125

116-93-324-41-008000

part stock: 5040

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-43-424-41-008000

part stock: 113

116-93-424-41-008000

part stock: 5019

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-93-624-41-008000

part stock: 4999

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

104-13-624-41-770000

part stock: 5021

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

104-13-424-41-770000

part stock: 5070

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,