Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,
Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,
Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,
Type: SIP, Number of Positions or Pins (Grid): 17 (1 x 17), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,
Type: PGA, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,