Sockets for ICs, Transistors

116-93-318-41-008000

116-93-318-41-008000

part stock: 5234

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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104-13-318-41-770000

104-13-318-41-770000

part stock: 5230

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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122-13-314-41-001000

122-13-314-41-001000

part stock: 5223

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 14 (2 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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127-93-316-41-002000

127-93-316-41-002000

part stock: 5254

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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128-PGM13039-10

128-PGM13039-10

part stock: 5261

Type: PGA, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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