Proto Board Type: SMD to DIP, Package Accepted: TSSOP, Number of Positions: 16, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: TSSOP, Number of Positions: 14, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: VSSOP, Number of Positions: 8, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 8, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 16, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: Through Hole to SIP, Package Accepted: Non Specific, Number of Positions: 6, Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 16, Pitch: 0.050" (1.27mm), Board Thickness: 0.031" (0.79mm) 1/32",
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 8, Pitch: 0.050" (1.27mm), Board Thickness: 0.031" (0.79mm) 1/32",
Proto Board Type: SMD to DIP, Package Accepted: SOT23, Number of Positions: 6, Pitch: 0.037" (0.95mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
