Sockets for ICs, Transistors

123-93-420-41-001000

part stock: 5351

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 20 (2 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

115-91-652-41-001000

part stock: 114

115-41-652-41-001000

part stock: 101

127-91-620-41-002000

part stock: 57

127-41-620-41-002000

part stock: 101

116-41-328-41-006000

part stock: 68

116-41-428-41-006000

part stock: 97

116-91-428-41-006000

part stock: 114

116-91-328-41-006000

part stock: 56

116-41-628-41-006000

part stock: 110

116-91-628-41-006000

part stock: 51

104-11-318-41-780000

part stock: 101

116-43-420-41-007000

part stock: 57

116-93-420-41-007000

part stock: 5383

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 20 (2 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-43-320-41-007000

part stock: 95

116-93-320-41-007000

part stock: 5346

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 20 (2 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

110-91-950-41-001000

part stock: 5343

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 50 (2 x 25), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

110-41-950-41-001000

part stock: 92

110-93-632-41-605000

part stock: 5355

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

110-43-632-41-605000

part stock: 73

126-91-316-41-001000

part stock: 54

126-41-316-41-001000

part stock: 76

126-43-314-41-001000

part stock: 116

126-93-314-41-001000

part stock: 5360

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 14 (2 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-41-322-41-008000

part stock: 124

116-91-320-41-001000

part stock: 48

116-41-420-41-001000

part stock: 37

116-91-422-41-008000

part stock: 63

116-41-320-41-001000

part stock: 102

116-91-420-41-001000

part stock: 119

116-91-322-41-008000

part stock: 121

116-41-422-41-008000

part stock: 107

104-11-322-41-770000

part stock: 69

18-822-90T

part stock: 5394

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

18-823-90T

part stock: 5336

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

18-810-90

part stock: 5344

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,