Sockets for ICs, Transistors

116-41-318-41-008000

part stock: 79

114-41-640-41-117000

part stock: 117

115-93-432-41-001000

part stock: 5464

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

115-43-432-41-001000

part stock: 70

110-93-428-41-001000

part stock: 5468

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

114-93-428-41-117000

part stock: 5486

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

146-91-422-41-012000

part stock: 32

114-93-628-41-117000

part stock: 18032

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

110-43-428-41-001000

part stock: 55

146-41-628-41-013000

part stock: 53

114-93-328-41-117000

part stock: 5484

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

146-41-422-41-012000

part stock: 50

114-43-328-41-117000

part stock: 91

146-91-628-41-013000

part stock: 28

114-43-428-41-117000

part stock: 117

114-43-628-41-117000

part stock: 103

104-11-318-41-770000

part stock: 105

127-91-316-41-002000

part stock: 39

127-41-316-41-002000

part stock: 52

122-11-310-41-001000

part stock: 71

110-93-316-41-105000

part stock: 23578

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

114-41-328-41-117000

part stock: 50

114-91-628-41-117000

part stock: 101

126-43-310-41-001000

part stock: 121

114-41-628-41-117000

part stock: 28

114-91-328-41-117000

part stock: 65

126-93-310-41-001000

part stock: 5517

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 10 (2 x 5), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

114-41-428-41-117000

part stock: 72

114-91-428-41-117000

part stock: 72

116-43-316-41-007000

part stock: 54

116-93-316-41-007000

part stock: 5479

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

110-93-636-41-001000

part stock: 5488

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

121-13-310-41-001000

part stock: 5495

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 10 (2 x 5), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

110-43-636-41-001000

part stock: 50

110-41-324-41-105000

part stock: 116

110-41-624-41-105000

part stock: 72