Sockets for ICs, Transistors

126-93-432-41-001000

part stock: 4902

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

127-91-428-41-002000

part stock: 69

116-41-636-41-003000

part stock: 116

127-91-628-41-002000

part stock: 59

127-41-428-41-002000

part stock: 27

116-91-636-41-003000

part stock: 69

127-41-628-41-002000

part stock: 31

110-13-950-41-001000

part stock: 4894

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 50 (2 x 25), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-41-322-41-002000

part stock: 43

126-91-322-41-002000

part stock: 100

110-13-322-41-801000

part stock: 4875

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 22 (2 x 11), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-91-422-41-002000

part stock: 51

126-41-422-41-002000

part stock: 122

117-43-640-41-105000

part stock: 117

110-43-952-41-001000

part stock: 114

116-41-648-41-008000

part stock: 103

116-91-648-41-008000

part stock: 116

110-93-952-41-001000

part stock: 4848

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-43-628-41-007000

part stock: 29

116-43-328-41-007000

part stock: 38

116-93-628-41-007000

part stock: 4852

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-93-328-41-007000

part stock: 4914

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-93-428-41-007000

part stock: 4898

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-43-428-41-007000

part stock: 79

111-93-650-41-001000

part stock: 4918

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 50 (2 x 25), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

111-43-650-41-001000

part stock: 62

123-11-318-41-001000

part stock: 107

104-11-648-41-770000

part stock: 45

110-93-316-10-003000

part stock: 4875

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), 8 Loaded, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

124-43-210-41-002000

part stock: 114

124-93-210-41-002000

part stock: 4861

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 10 (2 x 5), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

110-91-652-41-105000

part stock: 71

110-41-652-41-105000

part stock: 62

110-91-952-41-105000

part stock: 40

110-41-952-41-105000

part stock: 76

127-93-430-41-003000

part stock: 4851

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 30 (2 x 15), Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,