Sockets for ICs, Transistors

114-43-950-41-117000

part stock: 113

122-13-636-41-001000

part stock: 4463

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

115-43-328-61-003000

part stock: 80

123-13-632-41-001000

part stock: 4459

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

123-13-432-41-001000

part stock: 4471

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-93-642-41-003000

part stock: 4440

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 42 (2 x 21), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-43-642-41-003000

part stock: 92

110-13-318-61-001000

part stock: 32

110-13-650-41-001000

part stock: 4450

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 50 (2 x 25), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-41-428-41-002000

part stock: 88

126-41-328-41-002000

part stock: 108

126-41-628-41-002000

part stock: 46

126-91-428-41-002000

part stock: 31

126-91-628-41-002000

part stock: 114

126-91-328-41-002000

part stock: 38

116-91-650-41-003000

part stock: 75

116-41-650-41-003000

part stock: 52

116-43-650-41-008000

part stock: 115

116-93-650-41-008000

part stock: 4477

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 50 (2 x 25), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

104-11-640-41-780000

part stock: 107

123-93-652-41-001000

part stock: 4516

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-41-636-41-001000

part stock: 31

116-91-636-41-001000

part stock: 39

104-13-650-41-770000

part stock: 4492

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 50 (2 x 25), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

123-43-652-41-001000

part stock: 116

117-41-642-41-105000

part stock: 124

124-41-640-41-002000

part stock: 47

124-91-640-41-002000

part stock: 71

101-93-648-41-560000

part stock: 120

127-41-652-41-002000

part stock: 89

127-91-652-41-002000

part stock: 52

110-13-320-61-001000

part stock: 69

127-43-640-41-003000

part stock: 57

127-93-640-41-003000

part stock: 4466

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-43-652-41-007000

part stock: 79

116-93-652-41-007000

part stock: 4450

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,