Sockets for ICs, Transistors

100-020-050

part stock: 4331

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 20 (2 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 8.00µin (0.203µm), Contact Material - Mating: Beryllium Copper,

100-018-051

part stock: 4303

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 8.00µin (0.203µm), Contact Material - Mating: Beryllium Copper,

100-016-051

part stock: 4369

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 8.00µin (0.203µm), Contact Material - Mating: Beryllium Copper,

100-018-050

part stock: 8499

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 8.00µin (0.203µm), Contact Material - Mating: Beryllium Copper,

100-016-050

part stock: 4324

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 8.00µin (0.203µm), Contact Material - Mating: Beryllium Copper,

100-014-051

part stock: 4336

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 14 (2 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 8.00µin (0.203µm), Contact Material - Mating: Beryllium Copper,

100-014-050

part stock: 4328

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 14 (2 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 8.00µin (0.203µm), Contact Material - Mating: Beryllium Copper,

100-010-050

part stock: 4306

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 10 (2 x 5), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 8.00µin (0.203µm), Contact Material - Mating: Beryllium Copper,

100-008-051

part stock: 4280

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 8.00µin (0.203µm), Contact Material - Mating: Beryllium Copper,

100-006-050

part stock: 4264

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 6 (2 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 8.00µin (0.203µm), Contact Material - Mating: Beryllium Copper,

116-91-964-41-007000

part stock: 36

114-43-952-41-117000

part stock: 46

116-41-964-41-007000

part stock: 91

114-93-952-41-117000

part stock: 4443

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

123-43-324-41-801000

part stock: 113

104-11-952-41-780000

part stock: 95

123-43-632-41-801000

part stock: 93

123-93-632-41-801000

part stock: 113

126-41-950-41-001000

part stock: 56

126-91-650-41-001000

part stock: 97

126-41-650-41-001000

part stock: 74

104-13-648-41-780000

part stock: 4359

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 48 (2 x 24), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

126-91-950-41-001000

part stock: 49

117-41-668-41-005000

part stock: 66

117-91-668-41-005000

part stock: 124

122-13-324-41-801000

part stock: 4433

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

127-91-640-41-002000

part stock: 52

127-41-640-41-002000

part stock: 114

122-13-640-41-001000

part stock: 4429

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

124-91-328-41-002000

part stock: 71

124-41-328-41-002000

part stock: 37

116-93-640-41-007000

part stock: 4391

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

1674770-6

part stock: 4272

Type: PGA, ZIF (ZIP), Number of Positions or Pins (Grid): 479 (26 x 26), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Copper Alloy,

1-1903401-4

part stock: 4340

Type: PGA, Number of Positions or Pins (Grid): 638 (26 x 26), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Copper Alloy,

1735315-4

part stock: 4285

Type: PGA, ZIF (ZIP), Number of Positions or Pins (Grid): 939 (31 x 31), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Copper Alloy,

1-1747890-1

part stock: 6644

Type: LGA, Number of Positions or Pins (Grid): 771 (33 x 33), Pitch - Mating: 0.043" (1.09mm), Contact Finish - Mating: Gold, Contact Material - Mating: Copper Alloy,