Sockets for ICs, Transistors

116-93-952-41-007000

116-93-952-41-007000

part stock: 4392

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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127-93-628-41-003000

127-93-628-41-003000

part stock: 4407

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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127-93-428-41-003000

127-93-428-41-003000

part stock: 4426

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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116-93-632-41-001000

116-93-632-41-001000

part stock: 4437

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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116-93-432-41-001000

116-93-432-41-001000

part stock: 4435

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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123-93-636-41-001000

123-93-636-41-001000

part stock: 4422

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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123-13-424-41-001000

123-13-424-41-001000

part stock: 4471

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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104-13-632-41-780000

104-13-632-41-780000

part stock: 4472

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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104-13-432-41-780000

104-13-432-41-780000

part stock: 4443

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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116-93-636-41-007000

116-93-636-41-007000

part stock: 4439

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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114-93-950-41-117000

114-93-950-41-117000

part stock: 4472

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 50 (2 x 25), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

To Wishlist