Solder Stencils, Templates | Soldering, Desoldering, Rework Products | 13

PA0064-S

part stock: 6324

Type: QFN/LFCSP, Number of Positions: 24, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm),

To Wishlist

Chip Quik Inc.

PA0021-S

part stock: 6373

Type: SSOP, Number of Positions: 30, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

To Wishlist

Chip Quik Inc.

IPC0169-S

part stock: 5713

Type: SOIC, Number of Positions: 44, Pitch: 0.050" (1.27mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 1.106" L x 0.520" W (28.10mm x 13.20mm),

To Wishlist

Chip Quik Inc.

PA0072-S

part stock: 6378

Type: QFN/LFCSP, Number of Positions: 44, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm),

To Wishlist

Chip Quik Inc.

PA0146-S

part stock: 6407

Type: LLP, Number of Positions: 48, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm),

To Wishlist

Chip Quik Inc.

PA0178-S

part stock: 6373

Type: SOT/SC, Number of Positions: 6, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.059" L x 0.047" W (1.50mm x 1.20mm),

To Wishlist

Chip Quik Inc.

Type: DFN, Number of Positions: 8, Pitch: 0.050" (1.27mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.236" L x 0.197" W (6.00mm x 5.00mm), Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm),

To Wishlist

Chip Quik Inc.

PA0220-S

part stock: 5737

Type: TQFP, Number of Positions: 144, Pitch: 0.016" (0.40mm), Outer Dimension: 1.350" L x 1.950" W (34.29mm x 49.53mm), Inner Dimension: 0.630" L x 0.630" W (16.00mm x 16.00mm),

To Wishlist

Chip Quik Inc.

PA0120-S

part stock: 6356

Type: CSP, Number of Positions: 32, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.177" L x 0.217" W (4.50mm x 5.50mm),

To Wishlist

Chip Quik Inc.

IPC0074-S

part stock: 6343

Type: DFN, Number of Positions: 16, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm), Thermal Center Pad: 0.096" L x 0.171" W (2.45mm x 4.35mm),

To Wishlist

Chip Quik Inc.

PA0224-S

part stock: 6409

Type: SOP, Number of Positions: 40, Pitch: 0.050" (1.27mm), Outer Dimension: 0.900" L x 1.950" W (22.86mm x 49.53mm),

To Wishlist

Chip Quik Inc.

PA0009-S

part stock: 6367

Type: SOIC, Number of Positions: 24, Pitch: 0.050" (1.27mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

To Wishlist

Chip Quik Inc.

IPC0008-S

part stock: 6396

Type: QFN/LFCSP, Number of Positions: 16, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm), Thermal Center Pad: 0.094" L x 0.094" W (2.40mm x 2.40mm),

To Wishlist

Chip Quik Inc.

IPC0152-S

part stock: 6351

Type: DFN, Number of Positions: 18, Pitch: 0.016" (0.40mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.177" L x 0.138" W (4.50mm x 3.50mm), Thermal Center Pad: 0.083" L x 0.156" W (2.10mm x 3.95mm),

To Wishlist

Chip Quik Inc.

PA0170-S

part stock: 6338

Type: Mini SOIC, Number of Positions: 8, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm), Thermal Center Pad: 0.067" L x 0.315" W (1.70mm x 8.00mm),

To Wishlist

Chip Quik Inc.

IPC0096-S

part stock: 6351

Type: LGA, Number of Positions: 12, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm),

To Wishlist

Chip Quik Inc.

PA0094-S

part stock: 6137

Type: TQFP, Number of Positions: 48, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm),

To Wishlist

Chip Quik Inc.

PA0184-S

part stock: 6393

Type: TO/DDPAK, Number of Positions: 3, Pitch: 0.100" (2.54mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm), Thermal Center Pad: 0.394" L x 0.433" W (10.00mm x 11.00mm),

To Wishlist

Chip Quik Inc.

FPC125P010-S

part stock: 6321

Type: FPC/FFC, Number of Positions: 10, Pitch: 0.049" (1.25mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Thermal Center Pad: 0.157" L x 0.872" W (4.00mm x 22.15mm),

To Wishlist

Chip Quik Inc.

IPC0135-S

part stock: 6344

Type: TQFP, Number of Positions: 44, Pitch: 0.039" (1.00mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm),

To Wishlist

Chip Quik Inc.

IPC0003-S

part stock: 6383

Type: QFN/LFCSP, Number of Positions: 12, Pitch: 0.031" (0.80mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm), Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm),

To Wishlist

Chip Quik Inc.

IPC0057-S

part stock: 6401

Type: DFN, Number of Positions: 6, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.079" L x 0.083" W (2.00mm x 2.10mm), Thermal Center Pad: 0.026" L x 0.053" W (0.65mm x 1.35mm),

To Wishlist

Chip Quik Inc.

IPC0119-S

part stock: 6353

Type: DFN, Number of Positions: 6, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm),

To Wishlist

Chip Quik Inc.

PA0175-S

part stock: 6364

Type: SOT/SC, Number of Positions: 4, Pitch: 0.059" (1.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.140" L x 0.256" W (3.56mm x 6.50mm), Thermal Center Pad: 0.079" L x 0.130" W (2.00mm x 3.30mm),

To Wishlist

Chip Quik Inc.

PA0108-S

part stock: 5677

Type: PLCC/JLCC, Number of Positions: 68, Pitch: 0.050" (1.27mm), Outer Dimension: 1.350" L x 1.950" W (34.29mm x 49.53mm), Inner Dimension: 0.984" L x 0.984" W (25.00mm x 25.00mm),

To Wishlist

Chip Quik Inc.

PA0089-S

part stock: 6409

Type: SOT/SC, Number of Positions: 8, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

To Wishlist

Chip Quik Inc.

IPC0065-S

part stock: 6334

Type: DFN, Number of Positions: 8, Pitch: 0.031" (0.80mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm), Thermal Center Pad: 0.087" L x 0.118" W (2.20mm x 3.00mm),

To Wishlist

Chip Quik Inc.

PA0007-S

part stock: 6353

Type: SOIC, Number of Positions: 18, Pitch: 0.050" (1.27mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

To Wishlist

Chip Quik Inc.

PA0182-S

part stock: 6351

Type: SSOP, Number of Positions: 16, Pitch: 0.025" (0.64mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

To Wishlist

Chip Quik Inc.

PA0159-S

part stock: 6393

Type: BGA, Number of Positions: 14, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.083" L x 0.094" W (2.10mm x 2.40mm),

To Wishlist

Chip Quik Inc.

PA0080-S

part stock: 6332

Type: TVSOP, Number of Positions: 48, Pitch: 0.016" (0.40mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

To Wishlist

Chip Quik Inc.

IPC0068-S

part stock: 6388

Type: DFN, Number of Positions: 10, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm), Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm),

To Wishlist

Chip Quik Inc.

PA0014-S

part stock: 6400

Type: SOIC, Number of Positions: 54, Pitch: 0.050" (1.27mm), Outer Dimension: 0.900" L x 1.950" W (22.86mm x 49.53mm),

To Wishlist

Chip Quik Inc.

PA0098-S

part stock: 6414

Type: LGA, Number of Positions: 8, Pitch: 0.050" (1.27mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm),

To Wishlist

Chip Quik Inc.

IPC0147-S

part stock: 6322

Type: HSOP, Number of Positions: 48, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.630" L x 0.346" W (16.00mm x 8.80mm),

To Wishlist

Chip Quik Inc.

IPC0139-S

part stock: 5754

Type: TQFP, Number of Positions: 80, Pitch: 0.031" (0.80mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.551" L x 0.787" W (14.00mm x 20.00mm),

To Wishlist