Solder Stencils, Templates | Soldering, Desoldering, Rework Products | 13

FPC040P070-S

part stock: 6321

Type: FPC/FFC, Number of Positions: 70, Pitch: 0.016" (0.40mm), Outer Dimension: 0.900" L x 1.950" W (22.86mm x 49.53mm), Thermal Center Pad: 0.157" L x 1.331" W (4.00mm x 33.80mm),

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Chip Quik Inc.

IPC0108-S

part stock: 6341

Type: QFN/LFCSP, Number of Positions: 20, Pitch: 0.018" (0.45mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm), Thermal Center Pad: 0.061" L x 0.061" W (1.55mm x 1.55mm),

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Chip Quik Inc.

PA0078-S

part stock: 6323

Type: TVSOP, Number of Positions: 24, Pitch: 0.016" (0.40mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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Chip Quik Inc.

IPC0124-S

part stock: 6329

Type: DFN, Number of Positions: 12, Pitch: 0.018" (0.45mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm), Thermal Center Pad: 0.065" L x 0.094" W (1.65mm x 2.38mm),

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Chip Quik Inc.

PA0044-S

part stock: 6362

Type: VSOP, Number of Positions: 8, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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Chip Quik Inc.

IPC0094-S

part stock: 6329

Type: PowerSSOP, Number of Positions: 38, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.492" L x 0.240" W (12.50mm x 6.10mm), Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm),

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Chip Quik Inc.

IPC0146-S

part stock: 6413

Type: QFN/LFCSP, Number of Positions: 56, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.197" L x 0.433" W (5.00mm x 11.00mm), Thermal Center Pad: 0.096" L x 0.330" W (2.45mm x 8.38mm),

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Chip Quik Inc.

PA0104-S

part stock: 6321

Type: MQFP, Number of Positions: 52, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm),

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Chip Quik Inc.

FPC050P030-S

part stock: 6342

Type: FPC/FFC, Number of Positions: 30, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Thermal Center Pad: 0.157" L x 0.898" W (4.00mm x 22.80mm),

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Chip Quik Inc.

PA0097-S

part stock: 6362

Type: TSOP, Number of Positions: 32, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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Chip Quik Inc.

PA0143-S

part stock: 6403

Type: LLP, Number of Positions: 36, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm),

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Chip Quik Inc.

PA0043-S

part stock: 6383

Type: VSOP, Number of Positions: 8, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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Chip Quik Inc.

FPC030P071-S

part stock: 6418

Type: FPC/FFC, Number of Positions: 71, Pitch: 0.012" (0.30mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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Chip Quik Inc.

PA0153-S

part stock: 6382

Type: BGA, Number of Positions: 5, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.042" L x 0.055" W (1.06mm x 1.39mm),

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Chip Quik Inc.

PA0118-S

part stock: 6370

Type: CSP, Number of Positions: 48, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm),

To Wishlist