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Solder Stencils, Templates

PA0238-S
Chip Quik Inc.

PA0238-S

part stock: 6357

Type: SOIC, Number of Positions: 44, Pitch: 0.050" (1.27mm), Outer Dimension: 0.900" L x 1.950" W (22.86mm x 49.53mm),

To Wishlist
IPC0120-S
Chip Quik Inc.

IPC0120-S

part stock: 6369

Type: QFN/LFCSP, Number of Positions: 52, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm), Thermal Center Pad: 0.244" L x 0.244" W (6.20mm x 6.20mm),

To Wishlist
PA0090-S
Chip Quik Inc.

PA0090-S

part stock: 6386

Type: TSOC, Number of Positions: 6, Pitch: 0.050" (1.27mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

To Wishlist
PA0172-S
Chip Quik Inc.

PA0172-S

part stock: 6337

Type: POS, Number of Positions: 8, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.118" L x 0.098" W (3.00mm x 2.50mm),

To Wishlist
PA0140-S
Chip Quik Inc.

PA0140-S

part stock: 6327

Type: LLP, Number of Positions: 24, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.157" L x 0.197" W (4.00mm x 5.00mm),

To Wishlist
IPC0012-S
Chip Quik Inc.

IPC0012-S

part stock: 6355

Type: QFN/LFCSP, Number of Positions: 20, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm), Thermal Center Pad: 0.122" L x 0.122" W (3.10mm x 3.10mm),

To Wishlist
PA0209-S
Chip Quik Inc.

PA0209-S

part stock: 6374

Type: TSOP, Number of Positions: 50, Pitch: 0.031" (0.80mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

To Wishlist
PA0026-S
Chip Quik Inc.

PA0026-S

part stock: 6393

Type: uMAX, Number of Positions: 8, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

To Wishlist
PA0186-S
Chip Quik Inc.

PA0186-S

part stock: 6322

Type: TO/DDPAK, Number of Positions: 7, Pitch: 0.050" (1.27mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm), Thermal Center Pad: 0.370" L x 0.427" W (9.40mm x 10.85mm),

To Wishlist
PA0100-S
Chip Quik Inc.

PA0100-S

part stock: 6416

Type: LGA, Number of Positions: 16, Pitch: 0.039" (1.00mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.173" L x 0.295" W (4.40mm x 7.50mm),

To Wishlist
IPC0168-S
Chip Quik Inc.

IPC0168-S

part stock: 5695

Type: PowerSOIC, Number of Positions: 16, Pitch: 0.050" (1.27mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Thermal Center Pad: 0.130" L x 0.154" W (3.30mm x 3.90mm),

To Wishlist
PA0149-S
Chip Quik Inc.

PA0149-S

part stock: 6338

Type: LLP, Number of Positions: 60, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.354" L x 0.354" W (9.00mm x 9.00mm),

To Wishlist
PA0148-S
Chip Quik Inc.

PA0148-S

part stock: 6359

Type: LLP, Number of Positions: 56, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.354" L x 0.354" W (9.00mm x 9.00mm),

To Wishlist
PA0023-S
Chip Quik Inc.

PA0023-S

part stock: 6373

Type: SSOP, Number of Positions: 36, Pitch: 0.031" (0.80mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

To Wishlist
PA0190-S
Chip Quik Inc.

PA0190-S

part stock: 5674

Type: TQFP, Number of Positions: 128, Pitch: 0.016" (0.40mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm),

To Wishlist
PA0244-S
Chip Quik Inc.

PA0244-S

part stock: 6387

Type: TO/DPAK, Number of Positions: 5, Pitch: 0.045" (1.15mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.256" L x 0.244" W (6.50mm x 6.20mm), Thermal Center Pad: 0.276" L x 0.236" W (7.00mm x 6.00mm),

To Wishlist
PA0195-S
Chip Quik Inc.

PA0195-S

part stock: 6367

Type: TSSOP, Number of Positions: 28, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.173" L x 0.382" W (4.40mm x 9.70mm), Thermal Center Pad: 0.118" L x 0.630" W (3.00mm x 16.00mm),

To Wishlist
PA0027-S
Chip Quik Inc.

PA0027-S

part stock: 6194

Type: uMAX, Number of Positions: 10, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

To Wishlist
IPC0136-S
Chip Quik Inc.

IPC0136-S

part stock: 6357

Type: TQFP, Number of Positions: 48, Pitch: 0.031" (0.80mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.394" L x 0.551" W (10.00mm x 14.00mm),

To Wishlist
PA0058-S
Chip Quik Inc.

PA0058-S

part stock: 6331

Type: QFN/LFCSP, Number of Positions: 8, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm), Thermal Center Pad: 0.039" L x 0.197" W (1.00mm x 5.00mm),

To Wishlist
IPC0141-S
Chip Quik Inc.

IPC0141-S

part stock: 6326

Type: PowerSSO, Number of Positions: 36, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.407" L x 0.295" W (10.35mm x 7.50mm), Thermal Center Pad: 0.185" L x 0.217" W (4.70mm x 5.50mm),

To Wishlist
FPC040P030-S
Chip Quik Inc.

FPC040P030-S

part stock: 6400

Type: FPC/FFC, Number of Positions: 30, Pitch: 0.016" (0.40mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Thermal Center Pad: 0.157" L x 0.701" W (4.00mm x 17.80mm),

To Wishlist
PA0091-S
Chip Quik Inc.

PA0091-S

part stock: 6149

Type: TQFP, Number of Positions: 32, Pitch: 0.031" (0.80mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm),

To Wishlist
PA0213-S
Chip Quik Inc.

PA0213-S

part stock: 6407

Type: TSOP, Number of Positions: 86, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

To Wishlist
PA0206-S
Chip Quik Inc.

PA0206-S

part stock: 6399

Type: DFN, Number of Positions: 16, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm), Thermal Center Pad: 0.096" L x 0.354" W (2.45mm x 9.00mm),

To Wishlist
IPC0067-S
Chip Quik Inc.

IPC0067-S

part stock: 6319

Type: DFN, Number of Positions: 10, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm), Thermal Center Pad: 0.059" L x 0.079" W (1.50mm x 2.00mm),

To Wishlist
PA0051-S
Chip Quik Inc.

PA0051-S

part stock: 6402

Type: MLP/MLF, Number of Positions: 10, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm), Thermal Center Pad: 0.039" L x 0.197" W (1.00mm x 5.00mm),

To Wishlist
IPC0144-S
Chip Quik Inc.

IPC0144-S

part stock: 6360

Type: QFN/LFCSP, Number of Positions: 56, Pitch: 0.016" (0.40mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm), Thermal Center Pad: 0.204" L x 0.204" W (5.18mm x 5.18mm),

To Wishlist
PA0050-S
Chip Quik Inc.

PA0050-S

part stock: 6396

Type: MLP/MLF, Number of Positions: 8, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm), Thermal Center Pad: 0.039" L x 0.197" W (1.00mm x 5.00mm),

To Wishlist
PA0133-S
Chip Quik Inc.

PA0133-S

part stock: 6388

Type: LLP, Number of Positions: 6, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.087" L x 0.098" W (2.20mm x 2.50mm), Thermal Center Pad: 0.030" L x 0.197" W (0.75mm x 5.00mm),

To Wishlist
IPC0106-S
Chip Quik Inc.

IPC0106-S

part stock: 6354

Type: DFN, Number of Positions: 14, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm), Thermal Center Pad: 0.102" L x 0.118" W (2.60mm x 3.00mm),

To Wishlist
PA0003-S
Chip Quik Inc.

PA0003-S

part stock: 6348

Type: SOIC, Number of Positions: 14, Pitch: 0.050" (1.27mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

To Wishlist
IPC0063-S
Chip Quik Inc.

IPC0063-S

part stock: 6323

Type: DFN, Number of Positions: 8, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm), Thermal Center Pad: 0.055" L x 0.091" W (1.40mm x 2.30mm),

To Wishlist
PA0207-S
Chip Quik Inc.

PA0207-S

part stock: 6330

Type: TSOP, Number of Positions: 40, Pitch: 0.020" (0.50mm), Outer Dimension: 1.350" L x 1.950" W (34.29mm x 49.53mm),

To Wishlist
PA0187-S
Chip Quik Inc.

PA0187-S

part stock: 6412

Type: TO/DDPAK, Number of Positions: 9, Pitch: 0.038" (0.97mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm), Thermal Center Pad: 0.370" L x 0.427" W (9.40mm x 10.85mm),

To Wishlist
PA0152-S
Chip Quik Inc.

PA0152-S

part stock: 6357

Type: BGA, Number of Positions: 4, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm),

To Wishlist