Solder Stencils, Templates | Soldering, Desoldering, Rework Products | 13

PA0077-S

part stock: 6391

Type: TVSOP, Number of Positions: 20, Pitch: 0.016" (0.40mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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Chip Quik Inc.

IPC0140-S

part stock: 6418

Type: SSOP, Number of Positions: 36, Pitch: 0.031" (0.80mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.606" L x 0.295" W (15.40mm x 7.50mm),

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Chip Quik Inc.

Type: QFN/LFCSP, Number of Positions: 12, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm), Thermal Center Pad: 0.062" L x 0.110" W (1.58mm x 2.80mm),

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Chip Quik Inc.

IPC0075-S

part stock: 6333

Type: DFN, Number of Positions: 18, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm), Thermal Center Pad: 0.059" L x 0.173" W (1.50mm x 4.40mm),

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Chip Quik Inc.

PA0116-S

part stock: 6365

Type: CSP, Number of Positions: 24, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.138" L x 0.177" W (3.50mm x 4.50mm),

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Chip Quik Inc.

IPC0109-S

part stock: 6418

Type: LGA, Number of Positions: 28, Pitch: 0.024" (0.60mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.295" L x 0.173" W (7.50mm x 4.40mm),

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Chip Quik Inc.

IPC0019-S

part stock: 6343

Type: QFN/LFCSP, Number of Positions: 32, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.157" L x 0.236" W (4.00mm x 6.00mm), Thermal Center Pad: 0.098" L x 0.177" W (2.50mm x 4.50mm),

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Chip Quik Inc.

PA0047-S

part stock: 6406

Type: VSOP, Number of Positions: 28, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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Chip Quik Inc.

FPC080P020-S

part stock: 6392

Type: FPC/FFC, Number of Positions: 20, Pitch: 0.031" (0.80mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Thermal Center Pad: 0.157" L x 0.933" W (4.00mm x 23.70mm),

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Chip Quik Inc.

FPC050P020-S

part stock: 6376

Type: FPC/FFC, Number of Positions: 20, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Thermal Center Pad: 0.157" L x 0.701" W (4.00mm x 17.80mm),

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Chip Quik Inc.

PA0216-S

part stock: 6396

Type: TSOP, Number of Positions: 32, Pitch: 0.050" (1.27mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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Chip Quik Inc.

PA0076-S

part stock: 6383

Type: TVSOP, Number of Positions: 16, Pitch: 0.016" (0.40mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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Chip Quik Inc.

PA0135-S

part stock: 6320

Type: LLP, Number of Positions: 10, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm), Thermal Center Pad: 0.063" L x 0.236" W (1.60mm x 6.00mm),

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Chip Quik Inc.

PA0002-S

part stock: 6326

Type: SOIC, Number of Positions: 8, Pitch: 0.050" (1.27mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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Chip Quik Inc.

IPC0095-S

part stock: 6414

Type: QFN/LFCSP, Number of Positions: 36, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.197" L x 0.236" W (5.00mm x 6.00mm), Thermal Center Pad: 0.136" L x 0.180" W (3.45mm x 4.57mm),

To Wishlist

Chip Quik Inc.

IPC0080-S

part stock: 6372

Type: QFN/LFCSP, Number of Positions: 28, Pitch: 0.018" (0.45mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm), Thermal Center Pad: 0.094" L x 0.094" W (2.40mm x 2.40mm),

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Chip Quik Inc.

IPC0090-S

part stock: 6379

Type: LGA, Number of Positions: 12, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm),

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Chip Quik Inc.

IPC0033-S

part stock: 6409

Type: QFN/LFCSP, Number of Positions: 68, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm), Thermal Center Pad: 0.303" L x 0.303" W (7.70mm x 7.70mm),

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Chip Quik Inc.

IPC0125-S

part stock: 6361

Type: QFN/LFCSP, Number of Positions: 24, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.177" L x 0.138" W (4.50mm x 3.50mm), Thermal Center Pad: 0.081" L x 0.120" W (2.05mm x 3.05mm),

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Chip Quik Inc.

PA0218-S

part stock: 6330

Type: TSOP, Number of Positions: 28, Pitch: 0.022" (0.55mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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Chip Quik Inc.

PA0219-S

part stock: 6412

Type: PLCC/JLCC, Number of Positions: 52, Pitch: 0.050" (1.27mm), Outer Dimension: 1.350" L x 1.950" W (34.29mm x 49.53mm), Inner Dimension: 0.748" L x 0.748" W (19.00mm x 19.00mm),

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Chip Quik Inc.

PA0031-S

part stock: 6383

Type: QSOP, Number of Positions: 28, Pitch: 0.025" (0.64mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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Chip Quik Inc.

PA0040-S

part stock: 6398

Type: TSSOP, Number of Positions: 48, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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Chip Quik Inc.

IPC0050-S

part stock: 6401

Type: PowerSOIC, Number of Positions: 10, Pitch: 0.050" (1.27mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.295" L x 0.370" W (7.50mm x 9.40mm), Thermal Center Pad: 0.291" L x 0.413" W (7.40mm x 10.50mm),

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Chip Quik Inc.

IPC0073-S

part stock: 6334

Type: DFN, Number of Positions: 16, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm), Thermal Center Pad: 0.065" L x 0.173" W (1.65mm x 4.40mm),

To Wishlist

Chip Quik Inc.

IPC0089-S

part stock: 6376

Type: DFN, Number of Positions: 22, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.236" L x 0.197" W (6.00mm x 5.00mm), Thermal Center Pad: 0.102" L x 0.213" W (2.60mm x 5.40mm),

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Chip Quik Inc.

PA0137-S

part stock: 6413

Type: LLP, Number of Positions: 14, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.118" L x 0.157" W (3.00mm x 4.00mm), Thermal Center Pad: 0.063" L x 0.276" W (1.60mm x 7.00mm),

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Chip Quik Inc.

IPC0130-S

part stock: 6408

Type: SOT/SC, Number of Positions: 6, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm),

To Wishlist

Chip Quik Inc.

IPC0134-S

part stock: 6332

Type: TQFP, Number of Positions: 44, Pitch: 0.031" (0.80mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm),

To Wishlist

Chip Quik Inc.

IPC0117-S

part stock: 6320

Type: QFN/LFCSP, Number of Positions: 14, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm), Thermal Center Pad: 0.055" L x 0.083" W (1.40mm x 2.10mm),

To Wishlist

Chip Quik Inc.

PA0235-S

part stock: 6350

Type: LQFP, Number of Positions: 40, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm),

To Wishlist

Chip Quik Inc.

IPC0111-S

part stock: 6335

Type: HSOP, Number of Positions: 44, Pitch: 0.026" (0.65mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.630" L x 0.433" W (16.00mm x 11.00mm), Thermal Center Pad: 0.270" L x 0.630" W (6.85mm x 16.00mm),

To Wishlist

Chip Quik Inc.

PA0010-S

part stock: 6416

Type: SOP, Number of Positions: 24, Pitch: 0.050" (1.27mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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Chip Quik Inc.

PA0221-S

part stock: 6405

Type: TQFP, Number of Positions: 128, Pitch: 0.020" (0.50mm), Outer Dimension: 1.350" L x 1.950" W (34.29mm x 49.53mm), Inner Dimension: 0.551" L x 0.787" W (14.00mm x 20.00mm),

To Wishlist

Chip Quik Inc.

PA0157-S

part stock: 6368

Type: BGA, Number of Positions: 10, Pitch: 0.020" (0.50mm), Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm), Inner Dimension: 0.089" L x 0.098" W (2.25mm x 2.50mm),

To Wishlist

Chip Quik Inc.

PA0013-S

part stock: 6324

Type: SOIC, Number of Positions: 48, Pitch: 0.050" (1.27mm), Outer Dimension: 0.900" L x 1.950" W (22.86mm x 49.53mm),

To Wishlist