Type: Floating-Point Co-Processor, Mounting Type: Through Hole, Package / Case: 68-BCPGA, Supplier Device Package: 68-PGA (26.92x26.92),
Type: NTSC/PAL Modulator, Applications: Audio/Video, VCR's, Set-Top Boxes, Mounting Type: Surface Mount, Package / Case: 16-SOIC (0.154", 3.90mm Width), Supplier Device Package: 16-SOIC,
Type: Overvoltage Protection Controller, Applications: Cell Phones, Digital Cameras, Media Players, Mounting Type: Surface Mount, Package / Case: 6-WFDFN, Supplier Device Package: 6-uDFN (1.5x1.0),
Type: Overvoltage Protection Controller, Applications: Cell Phones, Media Players, Mounting Type: Surface Mount, Package / Case: 8-WFDFN Exposed Pad, Supplier Device Package: 8-TDFN (2x3),
Type: Digital Input, Applications: Automation Control, Mounting Type: Surface Mount, Package / Case: SOT-23-6, Supplier Device Package: SOT-6,
Type: Microcontroller, Applications: Infrared, Mounting Type: Surface Mount, Package / Case: 20-SOIC (0.295", 7.50mm Width), Supplier Device Package: 20-SOIC,
Type: Framer, Applications: Data Transport, Mounting Type: Surface Mount, Package / Case: 400-BBGA, Supplier Device Package: 400-PBGA (27x27),
Type: Overvoltage Protection, Applications: Control Systems, Mounting Type: Surface Mount, Package / Case: 8-SOIC (0.154", 3.90mm Width), Supplier Device Package: 8-SOIC,
Type: Parametric Measurement Unit, Applications: Automatic Test Equipment, Mounting Type: Surface Mount, Package / Case: 64-TQFP Exposed Pad, Supplier Device Package: 64-TQFP-EP (10x10),
Type: Protection Switch, Applications: T1/E1/J1, Mounting Type: Surface Mount, Package / Case: 32-WFQFN Exposed Pad, Supplier Device Package: 32-TQFN-EP (5x5),
Type: Transmission Line Clamp, Mounting Type: Surface Mount, Package / Case: 6-TSSOP, SC-88, SOT-363, Supplier Device Package: SOT-363-6 (SC-70),
Type: Support Circuit, Mounting Type: Surface Mount, Package / Case: 16-SSOP (0.154", 3.90mm Width), Supplier Device Package: 16-QSOP,
Type: Digital Micromirror Device (DMD), DLP PMIC, Mounting Type: Surface Mount, Package / Case: Module, Supplier Device Package: 80-LCCC (20.7x9.1),
Type: PCI CardBus Controller, Applications: High-Volume PC Applications, Mounting Type: Surface Mount, Package / Case: 224-LFBGA, Supplier Device Package: 224-NFBGA,
Type: DLP PMIC, LED Driver, Applications: DLP® Pico™ Projectors, Mounting Type: Surface Mount, Package / Case: 100-TQFP Exposed Pad, Supplier Device Package: 100-HTQFP (14x14),
Type: Digital Micromirror Device (DMD), Mounting Type: Surface Mount, Package / Case: 40-BFCLGA, Supplier Device Package: 40-CLGA (15.9x5.3),
Type: Digital Micromirror Device (DMD), Applications: 3D, Medical Imaging, Mounting Type: Through Hole, Package / Case: 350-BFCPGA, Supplier Device Package: 350-CPGA (35x32.2),
Type: Digital Micromirror Device (DMD), Mounting Type: Through Hole, Package / Case: 149-BFCPGA Exposed Pad, Supplier Device Package: 149-CPGA (22.3x32.2),
Type: Digital Micromirror Device (DMD), Applications: 3D, Medical Imaging, Mounting Type: Through Hole, Package / Case: 149-BFCPGA Exposed Pad, Supplier Device Package: 149-CPGA (22.3x32.2),
Type: Configuration PROM, Mounting Type: Surface Mount, Package / Case: 48-TFBGA, DSBGA, Supplier Device Package: 48-DSBGA (8x9),
Type: Digital Controller, Applications: Image Processing and Control, Mounting Type: Surface Mount, Package / Case: 419-BGA, Supplier Device Package: 419-BGA (23x23),
Type: Capacitor Discharge, Mounting Type: Surface Mount, Package / Case: 8-SOIC (0.154", 3.90mm Width), Supplier Device Package: 8-SOIC,
Type: Controller, Applications: Ground Fault Protection, Mounting Type: Through Hole, Package / Case: 8-DIP (0.300", 7.62mm), Supplier Device Package: 8-DIP,
Type: Broadband Front-End, Applications: Power Line Communications, Mounting Type: Surface Mount, Package / Case: 373-TFBGA, Supplier Device Package: 373-TFBGA (12x12),
Type: Programmable Peripherals IC, Applications: 8-Bit MCU Peripherals, Mounting Type: Surface Mount, Package / Case: 52-QFP, Supplier Device Package: 52-PQFP (10x10),
Type: Multi-Queue Flow-Control, Mounting Type: Surface Mount, Package / Case: 256-BBGA, Supplier Device Package: 256-BGA (17x17),
Type: Mechanical Sample, Mounting Type: Surface Mount,
Type: 10/100 Integrated Switch, Applications: Port Switch/Network Interface, Mounting Type: Surface Mount, Package / Case: 128-BFQFP, Supplier Device Package: 128-PQFP (14x20),
Type: Floating-Point Co-Processor, Mounting Type: Through Hole, Package / Case: 68-CPGA, Supplier Device Package: 68-CPGA (26.92x26.92),
