Type: Multi-Queue Flow-Control, Mounting Type: Surface Mount, Package / Case: 256-BBGA, Supplier Device Package: 256-BGA (17x17),
Type: Multi-Queue Flow-Control, Mounting Type: Surface Mount, Package / Case: 376-BGA, Supplier Device Package: 376-PBGA (23x23),
Type: Serial RapidIO® Switch, Applications: Wireless Infrastructure, Mounting Type: Surface Mount, Package / Case: 399-BGA Exposed Pad, Supplier Device Package: 399-TEPBGA (21x21),
Type: Serial RapidIO® Switch, Applications: Wireless Infrastructure, Mounting Type: Surface Mount, Package / Case: 675-BGA, FCBGA, Supplier Device Package: 675-FCBGA (27x27),
Type: Digital Micromirror Device (DMD), Mounting Type: Through Hole, Package / Case: 350-BFCPGA, Supplier Device Package: 350-CPGA (35x32.2),
Type: PCI CardBus Controller, Applications: High-Volume PC Applications, Mounting Type: Surface Mount, Package / Case: 257-LFBGA, Supplier Device Package: 257-BGA MICROSTAR (16x16),
Type: Digital Micromirror Device (DMD), Applications: 3D, Medical Imaging, Mounting Type: Surface Mount, Package / Case: 355-CLCC, Supplier Device Package: 355-LCCC (42.16x42.16),
Type: Digital Micromirror Device (DMD), Applications: 3D, Medical Imaging, Mounting Type: Surface Mount, Package / Case: 355-BCLGA, Supplier Device Package: 355-CLGA (42.2x42.2),
Type: Digital Micromirror Device (DMD), Applications: 3D, Medical Imaging, Mounting Type: Through Hole, Package / Case: 149-BFCPGA Exposed Pad, Supplier Device Package: 149-CPGA (22.3x32.2),
Type: Programmable Peripherals IC, Applications: 8-Bit MCU Peripherals, Mounting Type: Surface Mount, Package / Case: 80-LQFP, Supplier Device Package: 80-LQFP (12x12),
Type: HD-PLC Power Line Communications (PLC), Applications: Industrial Automation, Mounting Type: Surface Mount, Package / Case: 238-LBGA, Supplier Device Package: 238-LBGA (18x15),
Type: 10/100 Integrated Switch, Applications: Port Switch/Network Interface, Mounting Type: Surface Mount, Package / Case: 128-BFQFP, Supplier Device Package: 128-PQFP (14x20),
Type: Microcontroller, Applications: Infrared, Mounting Type: Surface Mount, Package / Case: 20-SSOP (0.209", 5.30mm Width), Supplier Device Package: 20-SSOP,
Type: Framer, Applications: Data Transport, Mounting Type: Surface Mount, Package / Case: 400-BBGA, Supplier Device Package: 400-PBGA (27x27),
Type: Authentication Chip, Mounting Type: Surface Mount, Package / Case: 10-WFDFN Exposed Pad, Supplier Device Package: 10-TDFN (3x4),
Type: High Voltage Half Bridge, Mounting Type: Through Hole, Package / Case: 7-SIP, Supplier Device Package: 7-SIP,
Type: Mechanical Sample, Mounting Type: Surface Mount,
Type: Transceiver, Applications: Instrumentation, Mounting Type: Surface Mount, Package / Case: 16-LBGA, FCBGA, Supplier Device Package: 16-FCBGA (4x4),
Type: Driver, Applications: Automotive, Mounting Type: Through Hole, Package / Case: 16-DIP (0.300", 7.62mm), Supplier Device Package: 16-DIP,
Type: Multiplexer, Applications: Cell Phones, Digital Cameras, Media Players, Mounting Type: Surface Mount, Package / Case: 24-UFQFN, Supplier Device Package: 24-UMLP (3.4x2.5),
Type: Transceiver, Applications: Instrumentation, Mounting Type: Surface Mount, Package / Case: 16-VFQFN Exposed Pad, Supplier Device Package: 16-QFN (3x3),
Applications: Factory/Home Automation, Mounting Type: Surface Mount, Package / Case: 2-FlipChip, Supplier Device Package: 2-FCP,
Type: Floating-Point Co-Processor, Mounting Type: Surface Mount, Package / Case: 68-LCC (J-Lead), Supplier Device Package: 68-PLCC (24.21x24.21),
