Type: Powerline Module, Mounting Type: Surface Mount, Package / Case: 50-SSIP Module, Supplier Device Package: 50-SIP Module,
Type: Digital Micromirror Device (DMD), Mounting Type: Surface Mount, Package / Case: 98-CLCC, Supplier Device Package: 98-LCCC (20.7x9.1),
Type: Digital Micromirror Device (DMD), Mounting Type: Surface Mount, Package / Case: Module, Supplier Device Package: 80-LCCC (20.7x9.1),
Type: Digital Micromirror Device (DMD),
Type: Multi-Queue Flow-Control, Mounting Type: Surface Mount, Package / Case: 256-BBGA, Supplier Device Package: 256-BGA (17x17),
Type: Floating-Point Co-Processor, Mounting Type: Through Hole, Package / Case: 18-DIP (0.300", 7.62mm), Supplier Device Package: 18-DIP,
Type: Floating-Point Co-Processor, Mounting Type: Through Hole, Package / Case: 8-DIP (0.300", 7.62mm), Supplier Device Package: 8-DIP,