Type: Floating-Point Co-Processor, Mounting Type: Surface Mount, Package / Case: 68-BECQFP, Supplier Device Package: 68-CQFP (24.13x24.13),
Type: 10/100 Integrated Switch, Applications: Port Switch/Network Interface, Mounting Type: Surface Mount, Package / Case: 208-BFQFP, Supplier Device Package: 208-PQFP (28x28),
Type: Code Hopping Encoder, Applications: Remote Secure Access, Keyless Entry, Mounting Type: Through Hole, Package / Case: 8-DIP (0.300", 7.62mm), Supplier Device Package: 8-PDIP,
Type: Multi-Queue Flow-Control, Mounting Type: Surface Mount, Package / Case: 256-BBGA, Supplier Device Package: 256-BGA (17x17),
Type: Sequential Flow-Control, Mounting Type: Surface Mount, Package / Case: 324-BGA, Supplier Device Package: 324-PBGA (19x19),
Type: Telemetry Controller, Mounting Type: Surface Mount, Package / Case: 132-CFlatPack, Supplier Device Package: 132-CQFP (24x24),
Type: Programmable Peripherals IC, Applications: 8-Bit MCU Peripherals, Mounting Type: Surface Mount, Package / Case: 52-LCC (J-Lead), Supplier Device Package: 52-PLCC (19.1x19.1),
Type: Programmable Peripherals IC, Applications: 8-Bit MCU Peripherals, Mounting Type: Surface Mount, Package / Case: 52-QFP, Supplier Device Package: 52-PQFP (10x10),
Type: Programmable Peripherals IC, Applications: 8-Bit MCU Peripherals, Mounting Type: Surface Mount, Package / Case: 80-LQFP, Supplier Device Package: 80-LQFP (12x12),
Type: Transceiver, Applications: Automotive, Mounting Type: Surface Mount, Package / Case: 36-BSSOP (0.295", 7.50mm Width) Exposed Pad, Supplier Device Package: PG-DSO-36-38,
Type: Mechanical Sample,
Type: Silicon Serial Number, Applications: PCB, Network Node, Equipment Identification/Registration, Mounting Type: Surface Mount, Package / Case: 6-LSOJ (0.148", 3.76mm Width), Supplier Device Package: 6-TSOC,
Type: Parametric Measurement Unit, Applications: Automatic Test Equipment, Mounting Type: Surface Mount, Package / Case: 64-TQFP Exposed Pad, Supplier Device Package: 64-TQFP-EP (10x10),
Type: Security Companion Chip, Applications: Networking and Communications, Mounting Type: Surface Mount, Package / Case: 6-WDFN Exposed Pad, Supplier Device Package: 6-TDFN (3x3),
Type: Overvoltage Protection, Applications: Control Systems, Mounting Type: Through Hole, Package / Case: 8-CDIP (0.300", 7.62mm), Supplier Device Package: 8-CERDIP,
Type: Data Acquisition Systems (DASs), Mounting Type: Surface Mount, Package / Case: 40-WFQFN Exposed Pad, Supplier Device Package: 40-TQFN (6x6),
Type: Floating-Point Co-Processor, Mounting Type: Surface Mount, Package / Case: 68-LCC (J-Lead), Supplier Device Package: 68-PLCC (24.21x24.21),
Type: Floating-Point Co-Processor, Mounting Type: Through Hole, Package / Case: 68-BCPGA, Supplier Device Package: 68-PGA (26.92x26.92),
Type: Differential DBUS Master, Mounting Type: Surface Mount, Package / Case: 16-SOIC (0.295", 7.50mm Width), Supplier Device Package: 16-SOIC,
Type: Mechanical Sample, Mounting Type: Surface Mount,
Type: Transceiver, Applications: Instrumentation, Mounting Type: Surface Mount, Package / Case: 16-VFQFN Exposed Pad, Supplier Device Package: 16-QFN (3x3),
Type: Dual Airbag Deployment ASIC, Mounting Type: Surface Mount, Package / Case: 20-SOIC (0.295", 7.50mm Width), Supplier Device Package: 20-SOIC,
Type: Encoder, Applications: RF, IR, Mounting Type: Through Hole, Package / Case: 8-DIP (0.300", 7.62mm), Supplier Device Package: 8-DIP,
Type: Manchester Encoder/Decoder, Applications: Security, Mounting Type: Surface Mount, Package / Case: 20-SOIC (0.295", 7.50mm Width), Supplier Device Package: 20-SOIC,
Type: Crosspoint Switch, Applications: Video, Mounting Type: Surface Mount, Package / Case: 16-SOIC (0.154", 3.90mm Width), Supplier Device Package: 16-SOIC,
Type: EDH Coprocessor, Mounting Type: Surface Mount, Package / Case: 64-LQFP, Supplier Device Package: 64-LQFP (14x14),
