Sockets for ICs, Transistors

506-AG11D-ESL-LF

part stock: 40063

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 6 (2 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,

516-AG10D-ESL

part stock: 30963

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Copper Alloy,

508-AG11D-ES

part stock: 41903

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Copper Alloy,

520-AG12D-ES-LF

part stock: 22399

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 20 (2 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

5-1437530-6

part stock: 22776

Type: SIP, Number of Positions or Pins (Grid): 12 (1 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

5-1571551-0

part stock: 48614

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Beryllium Copper,

508-AG10D-ES

part stock: 54473

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Copper Alloy,

5-1437539-3

part stock: 84973

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 20 (2 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 5.00µin (0.127µm), Contact Material - Mating: Copper Alloy,

508-AG10D-ESL

part stock: 65357

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 5.00µin (0.127µm), Contact Material - Mating: Beryllium Copper,

516-AG11D-ES

part stock: 77913

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Copper Alloy,

5-1437530-3

part stock: 30096

Type: SIP, Number of Positions or Pins (Grid): 9 (1 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

508-AG11D-ESL

part stock: 68350

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Copper Alloy,

506-AG11D-ESL

part stock: 150

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 6 (2 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Copper Alloy,

506-AG11D

part stock: 47805

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 6 (2 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Copper Alloy,

514-AG11D-ES

part stock: 77914

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 14 (2 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Copper Alloy,

506-AG12D-LF

part stock: 79852

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 6 (2 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

6-1437522-9

part stock: 1829

608-AG22

part stock: 2192

6-6437504-2

part stock: 4851

Type: Transistor, TO-3, Number of Positions or Pins (Grid): 3 (Oval), Contact Finish - Mating: Silver, Contact Material - Mating: Beryllium Copper,

643649-8

part stock: 8529

Type: SIP, Number of Positions or Pins (Grid): 17 (1 x 17), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Phosphor Bronze,

643645-3

part stock: 4783

Type: SIP, Number of Positions or Pins (Grid): 13 (1 x 13), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Phosphor Bronze,

643644-6

part stock: 4737

Type: SIP, Number of Positions or Pins (Grid): 12 (1 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

643640-8

part stock: 8512

Type: SIP, Number of Positions or Pins (Grid): 8 (1 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Phosphor Bronze,

641855-1

part stock: 4655

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

643648-3

part stock: 4631

Type: SIP, Number of Positions or Pins (Grid): 16 (1 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Phosphor Bronze,

643662-3

part stock: 4632

Type: SIP, Number of Positions or Pins (Grid): 30 (1 x 30), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Phosphor Bronze,

643653-1

part stock: 4597

Type: SIP, Number of Positions or Pins (Grid): 21 (1 x 21), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

643643-6

part stock: 8437

Type: SIP, Number of Positions or Pins (Grid): 11 (1 x 11), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

643642-8

part stock: 3752

Type: SIP, Number of Positions or Pins (Grid): 10 (1 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Phosphor Bronze,

643651-3

part stock: 3683

Type: SIP, Number of Positions or Pins (Grid): 19 (1 x 19), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Phosphor Bronze,

643650-6

part stock: 3677

Type: SIP, Number of Positions or Pins (Grid): 18 (1 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

643648-8

part stock: 3639

Type: SIP, Number of Positions or Pins (Grid): 16 (1 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Phosphor Bronze,

643647-8

part stock: 3597

Type: SIP, Number of Positions or Pins (Grid): 15 (1 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Phosphor Bronze,

643642-2

part stock: 3602

Type: SIP, Number of Positions or Pins (Grid): 10 (1 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

643640-6

part stock: 3591

Type: SIP, Number of Positions or Pins (Grid): 8 (1 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

6-1437542-2

part stock: 3612

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Material - Mating: Beryllium Copper,