Sockets for ICs, Transistors

3-1825276-2

3-1825276-2

part stock: 27665

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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3-822516-6

3-822516-6

part stock: 32926

Type: PLCC, Number of Positions or Pins (Grid): 84 (4 x 21), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Phosphor Bronze,

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3-1437530-1

3-1437530-1

part stock: 19049

Type: SIP, Number of Positions or Pins (Grid): 14 (1 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

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3-1437535-1

3-1437535-1

part stock: 17088

Type: SIP, Number of Positions or Pins (Grid): 20 (1 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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3-1437535-4

3-1437535-4

part stock: 20630

Type: SIP, Number of Positions or Pins (Grid): 20 (1 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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382444-1

382444-1

part stock: 33931

Type: SIP, Number of Positions or Pins (Grid): 6 (1 x 6), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 150.0µin (3.81µm), Contact Material - Mating: Phosphor Bronze,

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345725-5

345725-5

part stock: 35093

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 22 (2 x 11), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Material - Mating: Beryllium Copper,

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3-1437535-2

3-1437535-2

part stock: 28606

Type: SIP, Number of Positions or Pins (Grid): 7 (1 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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4-1814655-6

4-1814655-6

part stock: 4820

Type: SIP, Number of Positions or Pins (Grid): 5 (1 x 5), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 196.9µin (5.00µm), Contact Material - Mating: Beryllium Copper,

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4-1814655-3

4-1814655-3

part stock: 4816

Type: SIP, Number of Positions or Pins (Grid): 64 (1 x 64), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: Flash, Contact Material - Mating: Beryllium Copper,

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4-1814655-2

4-1814655-2

part stock: 4759

Type: SIP, Number of Positions or Pins (Grid): 64 (1 x 64), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 196.9µin (5.00µm), Contact Material - Mating: Beryllium Copper,

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4-1814655-1

4-1814655-1

part stock: 4794

Type: SIP, Number of Positions or Pins (Grid): 64 (1 x 64), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper,

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4-1571552-7

4-1571552-7

part stock: 4666

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 22 (2 x 11), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Material - Mating: Beryllium Copper,

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4-1571551-1

4-1571551-1

part stock: 8505

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 6 (2 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Beryllium Copper,

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4-1571552-5

4-1571552-5

part stock: 4665

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Material - Mating: Beryllium Copper,

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4-1571551-8

4-1571551-8

part stock: 4653

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Beryllium Copper,

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4-1571551-2

4-1571551-2

part stock: 4651

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Beryllium Copper,

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4-1571552-6

4-1571552-6

part stock: 4646

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 20 (2 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Material - Mating: Beryllium Copper,

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4-2013620-3

4-2013620-3

part stock: 4469

Type: PGA, ZIF (ZIP), Number of Positions or Pins (Grid): 989 (35 x 36), Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Copper Alloy,

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4-1437531-9

4-1437531-9

part stock: 3712

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Copper Alloy,

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4-1437530-7

4-1437530-7

part stock: 3691

Type: SIP, Number of Positions or Pins (Grid): 3 (1 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

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4-382568-0

4-382568-0

part stock: 3615

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Phosphor Bronze,

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4-1437542-5

4-1437542-5

part stock: 3579

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Material - Mating: Beryllium Copper,

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4-1437539-8

4-1437539-8

part stock: 3607

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 5.00µin (0.127µm), Contact Material - Mating: Copper Alloy,

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4-1437538-4

4-1437538-4

part stock: 3625

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 48 (2 x 24), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Material - Mating: Copper Alloy,

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4-1437532-5

4-1437532-5

part stock: 3556

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm),

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4-1437532-3

4-1437532-3

part stock: 3549

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm),

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4-1437504-5

4-1437504-5

part stock: 3548

Type: Transistor, TO-3, Number of Positions or Pins (Grid): 3 (Oval), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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4-1437537-1

4-1437537-1

part stock: 4826

Type: SIP, Number of Positions or Pins (Grid): 11 (1 x 11),

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4-382568-8

4-382568-8

part stock: 2511

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 48 (2 x 24), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Phosphor Bronze,

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4-1437538-9

4-1437538-9

part stock: 9641

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 64 (2 x 32), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Copper Alloy,

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4-1437539-6

4-1437539-6

part stock: 9621

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Material - Mating: Copper Alloy,

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4-1437538-8

4-1437538-8

part stock: 7064

Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 64 (2 x 32), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Copper Alloy,

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4-1437508-0

4-1437508-0

part stock: 9281

Type: Transistor, TO-5, Number of Positions or Pins (Grid): 8 (Round), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

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4-1437532-7

4-1437532-7

part stock: 8180

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm),

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