Sockets for ICs, Transistors

643649-1

643649-1

part stock: 40279

Type: SIP, Number of Positions or Pins (Grid): 17 (1 x 17), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

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643646-8

643646-8

part stock: 41271

Type: SIP, Number of Positions or Pins (Grid): 14 (1 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Phosphor Bronze,

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643644-8

643644-8

part stock: 46189

Type: SIP, Number of Positions or Pins (Grid): 12 (1 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Phosphor Bronze,

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6-1437539-3

6-1437539-3

part stock: 41425

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 22 (2 x 11), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 5.00µin (0.127µm), Contact Material - Mating: Copper Alloy,

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643642-6

643642-6

part stock: 56669

Type: SIP, Number of Positions or Pins (Grid): 10 (1 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

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6-6437535-7

6-6437535-7

part stock: 30045

Type: SIP, Number of Positions or Pins (Grid): 11 (1 x 11), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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6-1437535-6

6-1437535-6

part stock: 52111

Type: SIP, Number of Positions or Pins (Grid): 10 (1 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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799475-4

799475-4

part stock: 1820

Type: PGA, Number of Positions or Pins (Grid): 370 (19 x 19), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm),

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799278-3

799278-3

part stock: 1905

Type: Zig-Zag, Number of Positions or Pins (Grid): 370 (19 x 19), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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7-1437536-1

7-1437536-1

part stock: 4673

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

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7-1437529-6

7-1437529-6

part stock: 8743

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Copper Alloy,

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7-1437537-6

7-1437537-6

part stock: 3797

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 20 (2 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Copper Alloy,

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7-1437536-2

7-1437536-2

part stock: 3744

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Beryllium Copper,

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799288-1

799288-1

part stock: 3651

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Material - Mating: Beryllium Copper,

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7-1437532-8

7-1437532-8

part stock: 8367

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Pitch - Mating: 0.100" (2.54mm),

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7-1437532-1

7-1437532-1

part stock: 3464

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Copper Alloy,

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7-1437539-7

7-1437539-7

part stock: 9747

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 5.00µin (0.127µm), Contact Material - Mating: Copper Alloy,

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7-1437532-6

7-1437532-6

part stock: 9035

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Beryllium Copper,

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7-1437531-8

7-1437531-8

part stock: 16124

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 20 (2 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Copper Alloy,

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7-1437539-2

7-1437539-2

part stock: 31487

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Copper Alloy,

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7-1437539-0

7-1437539-0

part stock: 67841

Type: DIP, 0.5 to 0.6" Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 5.00µin (0.127µm), Contact Material - Mating: Copper Alloy,

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7-1437535-2

7-1437535-2

part stock: 33286

Type: SIP, Number of Positions or Pins (Grid): 16 (1 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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7-1437535-0

7-1437535-0

part stock: 37319

Type: SIP, Number of Positions or Pins (Grid): 14 (1 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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8058-1G19

8058-1G19

part stock: 3375

Type: Transistor, TO-5, Number of Positions or Pins (Grid): 8 (Round), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

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8080-1G1-LF

8080-1G1-LF

part stock: 4855

Type: Transistor, TO-3, Number of Positions or Pins (Grid): 3 (Oval), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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8080-1G7

8080-1G7

part stock: 3171

Type: Transistor, TO-3, Number of Positions or Pins (Grid): 4 (Round), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

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8059-2G9

8059-2G9

part stock: 3738

Type: Transistor, TO-5, Number of Positions or Pins (Grid): 3 (Round), Contact Finish - Mating: Gold, Contact Material - Mating: Copper Alloy,

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8058-1G30

8058-1G30

part stock: 4591

Type: Transistor, TO-5, Number of Positions or Pins (Grid): 4 (Round), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

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8-1437504-9

8-1437504-9

part stock: 9873

Type: Transistor, TO-3, Number of Positions or Pins (Grid): 3 (Oval), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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8080-1G37

8080-1G37

part stock: 5105

Type: Transistor, TO-3, Number of Positions or Pins (Grid): 3 (Oval), Contact Finish - Mating: Silver, Contact Finish Thickness - Mating: 500.0µin (12.70µm), Contact Material - Mating: Beryllium Copper,

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8080-1G36

8080-1G36

part stock: 5091

Type: Transistor, TO-3, Number of Positions or Pins (Grid): 3 (Oval), Contact Finish - Mating: Silver, Contact Finish Thickness - Mating: 500.0µin (12.70µm), Contact Material - Mating: Beryllium Copper,

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8080-1G3

8080-1G3

part stock: 5140

Type: Transistor, TO-3, Number of Positions or Pins (Grid): 3 (Oval), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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8080-1G35

8080-1G35

part stock: 5063

Type: Transistor, TO-3, Number of Positions or Pins (Grid): 3 (Oval), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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8080-1G2

8080-1G2

part stock: 5129

Type: Transistor, TO-3, Number of Positions or Pins (Grid): 3 (Oval), Contact Finish - Mating: Silver, Contact Finish Thickness - Mating: 500.0µin (12.70µm), Contact Material - Mating: Beryllium Copper,

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8080-1G16

8080-1G16

part stock: 5045

Type: Transistor, TO-3, Number of Positions or Pins (Grid): 3 (Oval), Contact Finish - Mating: Silver, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Copper,

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8058-1G55

8058-1G55

part stock: 1969

Type: Transistor, TO-5, Number of Positions or Pins (Grid): 20 (Round), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper,

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