Sockets for ICs, Transistors

110-13-632-41-801000

110-13-632-41-801000

part stock: 4766

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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146-93-640-41-012000

146-93-640-41-012000

part stock: 4812

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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121-13-624-41-001000

121-13-624-41-001000

part stock: 4828

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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121-13-324-41-001000

121-13-324-41-001000

part stock: 4796

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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121-13-424-41-001000

121-13-424-41-001000

part stock: 4787

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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124-93-420-41-002000

124-93-420-41-002000

part stock: 4781

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 20 (2 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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124-93-320-41-002000

124-93-320-41-002000

part stock: 4812

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 20 (2 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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101-93-640-41-560000

101-93-640-41-560000

part stock: 4776

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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126-93-316-41-003000

126-93-316-41-003000

part stock: 4832

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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104-13-636-41-780000

104-13-636-41-780000

part stock: 4816

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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111-93-652-41-001000

111-93-652-41-001000

part stock: 4840

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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1-1571551-0

1-1571551-0

part stock: 5578

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper,

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