Proto Board Type: SMD to PGA, Package Accepted: PLCC, Number of Positions: 68, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to SIP, Package Accepted: SOT-89, Number of Positions: 3, Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to SIP, Package Accepted: SOT-23, Number of Positions: 3, Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to SIP, Package Accepted: SOIC, Number of Positions: 16, Pitch: 0.050" (1.27mm), Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,
Package Accepted: SOIC, Number of Positions: 16, Pitch: 0.050" (1.27mm), Board Thickness: 0.031" (0.79mm) 1/32", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to Plated Through Hole Board, Package Accepted: TSSOP, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16",
Proto Board Type: SMD to Plated Through Hole Board, Package Accepted: TSSOP,
Proto Board Type: SMD to Plated Through Hole Board, Package Accepted: SOIC, Board Thickness: 0.062" (1.57mm) 1/16",
Proto Board Type: SMD to DIP, Package Accepted: PSOP, SSOP, TSOP, Board Thickness: 0.062" (1.57mm) 1/16",
Proto Board Type: SMD to Plated Through Hole Board, Package Accepted: QFP, Board Thickness: 0.062" (1.57mm) 1/16",
Proto Board Type: SMD to Plated Through Hole Board, Package Accepted: PLCC, Board Thickness: 0.062" (1.57mm) 1/16",
Proto Board Type: SMD to Plated Through Hole Board, Package Accepted: TQFP,
Proto Board Type: SMD to Plated Through Hole Board, Package Accepted: SOIC,
Proto Board Type: SMD to Plated Through Hole Board, Package Accepted: SOIC, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16",
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 8,
Proto Board Type: SMD to DIP, Package Accepted: SSOP, Number of Positions: 16, Pitch: 0.025" (0.64mm),
Proto Board Type: Through Hole to SIP, Package Accepted: Rotary Switch, Number of Positions: 11,
Proto Board Type: Through Hole to SIP, Package Accepted: Tactile Switch, Number of Positions: 6,
Proto Board Type: SMD to SIP, Package Accepted: 1/4" TRS Jack, Number of Positions: 7,
Proto Board Type: SMD to DIP, Package Accepted: BGA, Number of Positions: 42, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Package Accepted: BGA, Number of Positions: 484, Pitch: 0.039" (1.00mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Package Accepted: BGA, Number of Positions: 100, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Package Accepted: BGA, Number of Positions: 484, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Package Accepted: BGA, Number of Positions: 100, Pitch: 0.031" (0.80mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Package Accepted: BGA, Number of Positions: 100, Pitch: 0.039" (1.00mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: BGA, Number of Positions: 54, Pitch: 0.029" (0.75mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: BGA, Number of Positions: 25, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Package Accepted: BGA, Number of Positions: 324, Pitch: 0.031" (0.80mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Package Accepted: BGA, Number of Positions: 100, Pitch: 0.026" (0.65mm), Board Thickness: 0.063" (1.60mm), Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: BGA, Number of Positions: 25, Pitch: 0.016" (0.40mm),
Proto Board Type: SMD to DIP, Package Accepted: BGA, Number of Positions: 54, Pitch: 0.047" (1.20mm),
