Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 8, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 14, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 16, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Number of Positions: 10, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 18, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Number of Positions: 12, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SSOP, Number of Positions: 14, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SSOP, Number of Positions: 16, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16",
Proto Board Type: SMD to SMD, Package Accepted: SOIC, Number of Positions: 16, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SSOP, Number of Positions: 14, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16",
Proto Board Type: SMD to DIP, Package Accepted: SSOP, Number of Positions: 16, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SOT, Number of Positions: 6, Pitch: 0.037" (0.95mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 8, Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Package Accepted: SSOP, Number of Positions: 20, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16",
Proto Board Type: SMD to DIP, Package Accepted: SOIC, Number of Positions: 28, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Material: FR4 Epoxy Glass,
Proto Board Type: Connector to DIP, Package Accepted: CR1220, Number of Positions: 4, Pitch: 0.100" (2.54mm),
Proto Board Type: SMD to DIP, Package Accepted: QFN, QFP, Number of Positions: 48,
Proto Board Type: Connector to DIP, Package Accepted: CR2032, Number of Positions: 4, Pitch: 0.100" (2.54mm), Board Thickness: 0.060" (1.52mm),
Proto Board Type: SMD to DIP, Package Accepted: QFN, QFP, Number of Positions: 32,
Proto Board Type: SMD to Plated Through Hole Board, Package Accepted: FPC, Number of Positions: 20,
Proto Board Type: Plated Through Hole to Plated Through Hole, Pitch: 0.197" (5.00mm),
