Type: Programmable Peripherals IC, Applications: 8-Bit MCU Peripherals, Mounting Type: Surface Mount, Package / Case: 52-LCC (J-Lead), Supplier Device Package: 52-PLCC (19.1x19.1),
Type: Ultrasound Pulser, Applications: Ultrasound Imaging, Mounting Type: Surface Mount, Package / Case: 56-VFLGA, Supplier Device Package: 56-TFLGA (8x8),
Type: 10/100 Integrated Switch, Applications: Port Switch/Network Interface, Mounting Type: Surface Mount, Package / Case: 128-BFQFP, Supplier Device Package: 128-PQFP (14x20),
Type: Floating-Point Co-Processor, Mounting Type: Surface Mount, Package / Case: 68-BECQFP, Supplier Device Package: 68-CQFP (24.13x24.13),
Type: Video Processor, Applications: Video, Mounting Type: Surface Mount, Package / Case: 80-TQFP, Supplier Device Package: 80-TQFP (12x12),
Type: DLP PMIC, LED Driver, Applications: DLP® Pico™ Projectors, Mounting Type: Surface Mount, Package / Case: 100-TQFP Exposed Pad, Supplier Device Package: 100-HTQFP (14x14),
Type: Digital Micromirror Device (DMD), Mounting Type: Surface Mount, Package / Case: 100-BFCLGA Module, Supplier Device Package: 100-CLGA (24.5x11),
Type: PCI CardBus Controller, Applications: High-Volume PC Applications, Mounting Type: Surface Mount, Package / Case: 209-LFBGA, Supplier Device Package: 209-PBGA (16x16),
Type: TFT VCOM Calibrator, Mounting Type: Surface Mount, Package / Case: 10-WFDFN Exposed Pad, Supplier Device Package: 10-WSON (3x3),
Type: Digital Micromirror Device (DMD), Mounting Type: Surface Mount, Package / Case: 80-BFCLGA, Supplier Device Package: 80-CLGA (21.3x11),
Type: Multi-Queue Flow-Control, Mounting Type: Surface Mount, Package / Case: 256-BBGA, Supplier Device Package: 256-BGA (17x17),
Type: Serial RapidIO® Switch, Applications: Wireless Infrastructure, Mounting Type: Surface Mount, Package / Case: 675-BGA, FCBGA, Supplier Device Package: 675-FCBGA (27x27),
Type: Serial RapidIO® Switch, Applications: Wireless Infrastructure, Mounting Type: Surface Mount, Package / Case: 675-BGA Exposed Pad, Supplier Device Package: 675-TEPBGA (27x27),
Type: Serial RapidIO® Switch, Applications: Wireless Infrastructure, Mounting Type: Surface Mount, Package / Case: 399-BGA Exposed Pad, Supplier Device Package: 399-TEPBGA (21x21),
Type: Timing Control, Mounting Type: Surface Mount, Package / Case: 28-VFQFN Exposed Pad, Supplier Device Package: 28-QFN (5x5),
Type: Authentication Chip, Mounting Type: Surface Mount, Package / Case: 10-WFDFN Exposed Pad, Supplier Device Package: 10-TDFN (3x4),
Type: Resistor Network, Applications: Instrumentation Amplifiers, Mounting Type: Surface Mount, Package / Case: 14-TSSOP (0.173", 4.40mm Width), Supplier Device Package: 14-TSSOP,
Type: PHY Transceiver, Applications: Testing Equipment, Mounting Type: Surface Mount, Package / Case: 400-BBGA, Supplier Device Package: 400-PBGA (27x27),
Type: Ultrasound Receivers, Applications: Ultrasound Imaging, Mounting Type: Surface Mount, Package / Case: 380-LFBGA, CSPBGA,
Type: Overvoltage Protection, Applications: Control Systems, Mounting Type: Surface Mount, Package / Case: 18-SOIC (0.295", 7.50mm Width), Supplier Device Package: 18-SOIC,
Type: Transceiver, Applications: Automotive, Mounting Type: Surface Mount, Package / Case: 36-BSSOP (0.295", 7.50mm Width) Exposed Pad, Supplier Device Package: PG-DSO-36-38,
Type: Floating-Point Co-Processor, Mounting Type: Through Hole, Package / Case: 68-BCPGA, Supplier Device Package: 68-PGA (26.92x26.92),
Type: Floating-Point Co-Processor, Mounting Type: Surface Mount, Package / Case: 68-LCC (J-Lead), Supplier Device Package: 68-PLCC (24.21x24.21),
Type: Mechanical Sample, Mounting Type: Surface Mount,
Type: Mechanical Sample,
Type: Universal Timer Controller, Mounting Type: Through Hole, Package / Case: 4-SIP, Supplier Device Package: TO-94,
