Type: Parametric Measurement Unit, Applications: Automatic Test Equipment, Mounting Type: Surface Mount, Package / Case: 64-TQFP Exposed Pad, Supplier Device Package: 64-TQFP-EP (10x10),
Type: Silicon Serial Number, Applications: PCB, Network Node, Equipment Identification/Registration, Mounting Type: Surface Mount, Package / Case: 4-XFBGA, FCBGA, Supplier Device Package: 4-FlipChip (0.69x1.09),
Type: Protection Switch, Applications: T1/E1/J1, Mounting Type: Surface Mount, Package / Case: 32-WFQFN Exposed Pad, Supplier Device Package: 32-TQFN-EP (5x5),
Type: Silicon Serial Number, Applications: PCB, Network Node, Equipment Identification/Registration, Mounting Type: Surface Mount, Package / Case: TO-236-3, SC-59, SOT-23-3, Supplier Device Package: SOT-23-3,
Type: Overvoltage Protection Controller, Applications: Cell Phones, Digital Cameras, Media Players, Mounting Type: Surface Mount, Package / Case: 6-WFDFN, Supplier Device Package: 6-uDFN (1.5x1.0),
Type: Security Controller, Mounting Type: Surface Mount, Package / Case: 25-TFBGA, CSPBGA, Supplier Device Package: 25-CSBGA (5x5),
Type: Digital Micromirror Device (DMD), Applications: 3D, Medical Imaging, Mounting Type: Surface Mount, Package / Case: 355-CLCC, Supplier Device Package: 355-LCCC (42.16x42.16),
Type: Digital Controller, Applications: Image Processing and Control, Mounting Type: Surface Mount, Package / Case: 676-BBGA, FCBGA, Supplier Device Package: 676-FCBGA (27x27),
Type: Digital Micromirror Device (DMD), Mounting Type: Through Hole, Package / Case: 149-BCPGA, Supplier Device Package: 149-CLGA (32.2x22.3),
Type: Digital Micromirror Device (DMD), Applications: 3D, Medical Imaging, Mounting Type: Surface Mount, Package / Case: 355-BCLGA, Supplier Device Package: 355-CLGA (42.2x42.2),
Type: Digital Micromirror Device (DMD), DLP PMIC, Mounting Type: Surface Mount, Package / Case: 203-BECLGA, Supplier Device Package: 203-CLGA (40.64x31.75),
Type: Digital Micromirror Device (DMD), Mounting Type: Surface Mount, Package / Case: 42-BFCLGA, Supplier Device Package: 42-CLGA (14.12x4.97),
Type: PCI CardBus Controller, Applications: High-Volume PC Applications, Mounting Type: Surface Mount, Package / Case: 208-LQFP, Supplier Device Package: 208-LQFP,
Type: 10/100 Integrated Switch, Applications: Port Switch/Network Interface, Mounting Type: Surface Mount, Package / Case: 128-BFQFP, Supplier Device Package: 128-PQFP (14x20),
Type: Code Hopping Encoder and Transponder, Applications: Remote Secure Access, Keyless Entry, Mounting Type: Through Hole, Package / Case: 8-DIP (0.300", 7.62mm), Supplier Device Package: 8-PDIP,
Type: Floating-Point Co-Processor, Mounting Type: Through Hole, Package / Case: 68-CPGA, Supplier Device Package: 68-CPGA (26.92x26.92),
Type: Transceiver, Applications: Automotive, Mounting Type: Surface Mount, Package / Case: 36-BSSOP (0.295", 7.50mm Width) Exposed Pad, Supplier Device Package: PG-DSO-36-38,
Type: Programmable Peripherals IC, Applications: 8-Bit MCU Peripherals, Mounting Type: Surface Mount, Package / Case: 52-QFP, Supplier Device Package: 52-PQFP (10x10),
Type: Programmable Peripherals IC, Applications: 16-Bit MCU Peripherals, Mounting Type: Surface Mount, Package / Case: 80-LQFP, Supplier Device Package: 80-LQFP (12x12),
Type: Programmable Peripherals IC, Applications: 8-Bit MCU Peripherals, Mounting Type: Surface Mount, Package / Case: 52-LCC (J-Lead), Supplier Device Package: 52-PLCC (19.1x19.1),
Type: Transceiver, Applications: Instrumentation, Mounting Type: Surface Mount, Package / Case: 16-VFQFN Exposed Pad, Supplier Device Package: 16-QFN (3x3),
Mounting Type: Through Hole, Package / Case: 13-SIP Formed Leads, Supplier Device Package: 13-PDBS,
Type: Floating-Point Co-Processor, Mounting Type: Surface Mount, Package / Case: 68-LCC (J-Lead), Supplier Device Package: 68-PLCC (24.21x24.21),
Type: Serial RapidIO® Switch, Applications: Wireless Infrastructure, Mounting Type: Surface Mount, Package / Case: 399-BBGA, FCBGA, Supplier Device Package: 399-FCBGA (21x21),
Type: Multi-Queue Flow-Control, Mounting Type: Surface Mount, Package / Case: 256-BBGA, Supplier Device Package: 256-BGA (17x17),
Type: Serial RapidIO® Switch, Applications: Wireless Infrastructure, Mounting Type: Surface Mount, Package / Case: 399-BGA Exposed Pad, Supplier Device Package: 399-TEPBGA (21x21),
Type: Processor Companion, Applications: Processor-Based Systems, Mounting Type: Surface Mount, Package / Case: 14-SOIC (0.154", 3.90mm Width), Supplier Device Package: 14-SOIC,
