| Type | Description |
| Part Status | Active |
|---|---|
| Type | SIP |
| Number of Positions or Pins (Grid) | 15 (1 x 15) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 10.0µin (0.25µm) |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled |
| Operating Temperature | -55°C ~ 125°C |
| RoHS Status | RoHS Compliant |
|---|---|
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Lifecycle Status | Obsolete / End of life |
| Stock Category | Available stock |
