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Sockets for ICs, Transistors

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209-PGM17020-10H
Aries Electronics

209-PGM17020-10H

part stock: 1693

Type: PGA, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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20-PLS13120-12
Aries Electronics

20-PLS13120-12

part stock: 1754

Type: PGA, ZIF (ZIP), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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20-PRS13120-12
Aries Electronics

20-PRS13120-12

part stock: 1811

Type: PGA, ZIF (ZIP), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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28-6554-16
Aries Electronics

28-6554-16

part stock: 1992

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Copper,

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28-3554-16
Aries Electronics

28-3554-16

part stock: 2043

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Copper,

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281-PGM18037-11
Aries Electronics

281-PGM18037-11

part stock: 2051

Type: PGA, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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24-6554-16
Aries Electronics

24-6554-16

part stock: 2250

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Copper,

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28-6553-16
Aries Electronics

28-6553-16

part stock: 2231

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Nickel,

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28-3553-16
Aries Electronics

28-3553-16

part stock: 2279

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Copper,

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28-3551-16
Aries Electronics

28-3551-16

part stock: 2211

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Copper,

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28-6551-16
Aries Electronics

28-6551-16

part stock: 2207

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Copper,

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28-6552-16
Aries Electronics

28-6552-16

part stock: 2240

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Copper,

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232-PGM17037-11
Aries Electronics

232-PGM17037-11

part stock: 2305

Type: PGA, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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24-3554-16
Aries Electronics

24-3554-16

part stock: 2290

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Copper,

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225-PGM15001-11
Aries Electronics

225-PGM15001-11

part stock: 2272

Type: PGA, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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224-PGM15038-11H
Aries Electronics

224-PGM15038-11H

part stock: 2330

Type: PGA, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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24-6551-16
Aries Electronics

24-6551-16

part stock: 2434

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Copper,

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24-3551-16
Aries Electronics

24-3551-16

part stock: 2411

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Copper,

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24-6553-16
Aries Electronics

24-6553-16

part stock: 2427

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Copper,

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24-3553-16
Aries Electronics

24-3553-16

part stock: 2437

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Copper,

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24-3552-16
Aries Electronics

24-3552-16

part stock: 2444

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Copper,

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24-6552-16
Aries Electronics

24-6552-16

part stock: 2452

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Copper,

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209-PGM17030-11
Aries Electronics

209-PGM17030-11

part stock: 2460

Type: PGA, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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209-PGM17046-11
Aries Electronics

209-PGM17046-11

part stock: 2468

Type: PGA, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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28-6556-41
Aries Electronics

28-6556-41

part stock: 2489

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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28-6556-40
Aries Electronics

28-6556-40

part stock: 2704

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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28-3575-16
Aries Electronics

28-3575-16

part stock: 2754

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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28-6575-16
Aries Electronics

28-6575-16

part stock: 2769

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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28-3572-16
Aries Electronics

28-3572-16

part stock: 2802

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Nickel,

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28-3570-16
Aries Electronics

28-3570-16

part stock: 2836

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Nickel,

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28-6572-16
Aries Electronics

28-6572-16

part stock: 2825

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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28-3573-16
Aries Electronics

28-3573-16

part stock: 2840

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Nickel,

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28-6570-16
Aries Electronics

28-6570-16

part stock: 2850

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Nickel,

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28-3574-16
Aries Electronics

28-3574-16

part stock: 2772

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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28-6574-16
Aries Electronics

28-6574-16

part stock: 2774

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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28-6573-16
Aries Electronics

28-6573-16

part stock: 2768

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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