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Sockets for ICs, Transistors

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16-810-90WR
Aries Electronics

16-810-90WR

part stock: 7732

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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17-7490-10
Aries Electronics

17-7490-10

part stock: 7798

Type: SIP, Number of Positions or Pins (Grid): 17 (1 x 17), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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17-71250-10
Aries Electronics

17-71250-10

part stock: 7764

Type: SIP, Number of Positions or Pins (Grid): 17 (1 x 17), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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17-7650-10
Aries Electronics

17-7650-10

part stock: 7792

Type: SIP, Number of Positions or Pins (Grid): 17 (1 x 17), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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17-7500-10
Aries Electronics

17-7500-10

part stock: 7819

Type: SIP, Number of Positions or Pins (Grid): 17 (1 x 17), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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17-7750-10
Aries Electronics

17-7750-10

part stock: 7819

Type: SIP, Number of Positions or Pins (Grid): 17 (1 x 17), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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15-0501-31
Aries Electronics

15-0501-31

part stock: 7853

Type: SIP, Number of Positions or Pins (Grid): 15 (1 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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15-0501-21
Aries Electronics

15-0501-21

part stock: 7808

Type: SIP, Number of Positions or Pins (Grid): 15 (1 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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10-6621-30
Aries Electronics

10-6621-30

part stock: 7848

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 10 (2 x 5), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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16-1508-31
Aries Electronics

16-1508-31

part stock: 7866

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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16-1508-21
Aries Electronics

16-1508-21

part stock: 7813

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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16-0508-31
Aries Electronics

16-0508-31

part stock: 7851

Type: SIP, Number of Positions or Pins (Grid): 16 (1 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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16-0508-21
Aries Electronics

16-0508-21

part stock: 7875

Type: SIP, Number of Positions or Pins (Grid): 16 (1 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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14-1508-31
Aries Electronics

14-1508-31

part stock: 7908

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 14 (2 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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14-1508-21
Aries Electronics

14-1508-21

part stock: 7832

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 14 (2 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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14-0508-21
Aries Electronics

14-0508-21

part stock: 7917

Type: SIP, Number of Positions or Pins (Grid): 14 (1 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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14-0508-31
Aries Electronics

14-0508-31

part stock: 7843

Type: SIP, Number of Positions or Pins (Grid): 14 (1 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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12-6621-30
Aries Electronics

12-6621-30

part stock: 7845

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 12 (2 x 6), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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18-8250-310C
Aries Electronics

18-8250-310C

part stock: 7893

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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18-8400-310C
Aries Electronics

18-8400-310C

part stock: 7898

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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18-8300-310C
Aries Electronics

18-8300-310C

part stock: 7956

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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18-8375-310C
Aries Electronics

18-8375-310C

part stock: 7903

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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18-81250-310C
Aries Electronics

18-81250-310C

part stock: 7902

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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18-8600-310C
Aries Electronics

18-8600-310C

part stock: 7950

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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18-8406-310C
Aries Electronics

18-8406-310C

part stock: 7891

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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18-8670-310C
Aries Electronics

18-8670-310C

part stock: 7944

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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18-8750-310C
Aries Electronics

18-8750-310C

part stock: 7965

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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18-81000-310C
Aries Electronics

18-81000-310C

part stock: 7922

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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18-8500-310C
Aries Electronics

18-8500-310C

part stock: 7897

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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18-8545-310C
Aries Electronics

18-8545-310C

part stock: 7906

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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18-8465-310C
Aries Electronics

18-8465-310C

part stock: 7890

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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16-8810-310C
Aries Electronics

16-8810-310C

part stock: 7953

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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16-8530-310C
Aries Electronics

16-8530-310C

part stock: 7894

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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16-8620-310C
Aries Electronics

16-8620-310C

part stock: 7922

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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16-8550-310C
Aries Electronics

16-8550-310C

part stock: 7903

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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16-8250-310C
Aries Electronics

16-8250-310C

part stock: 7917

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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