Sockets for ICs, Transistors

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Sockets for ICs, Transistors

Aries Electronics

05-7380-10

part stock: 10009

Type: SIP, Number of Positions or Pins (Grid): 5 (1 x 5), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

05-7880-10

part stock: 9975

Type: SIP, Number of Positions or Pins (Grid): 5 (1 x 5), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

06-7425-10

part stock: 10034

Type: SIP, Number of Positions or Pins (Grid): 6 (1 x 6), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

06-7755-10

part stock: 9985

Type: SIP, Number of Positions or Pins (Grid): 6 (1 x 6), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

06-71187-10

part stock: 10038

Type: SIP, Number of Positions or Pins (Grid): 6 (1 x 6), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

06-7XXXX-10

part stock: 10038

Type: SIP, Number of Positions or Pins (Grid): 6 (1 x 6), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

06-7360-10

part stock: 10038

Type: SIP, Number of Positions or Pins (Grid): 6 (1 x 6), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

07-7XXXX-10

part stock: 10115

Type: SIP, Number of Positions or Pins (Grid): 7 (1 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

08-8255-211C

part stock: 10305

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

09-0501-20

part stock: 10384

Type: SIP, Number of Positions or Pins (Grid): 9 (1 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

09-0501-30

part stock: 10398

Type: SIP, Number of Positions or Pins (Grid): 9 (1 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

08-6810-90T

part stock: 10491

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

08-823-90

part stock: 10498

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

07-0501-21

part stock: 10541

Type: SIP, Number of Positions or Pins (Grid): 7 (1 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

07-0501-31

part stock: 10621

Type: SIP, Number of Positions or Pins (Grid): 7 (1 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

03-7880-10

part stock: 10655

Type: SIP, Number of Positions or Pins (Grid): 3 (1 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

03-7360-10

part stock: 10695

Type: SIP, Number of Positions or Pins (Grid): 3 (1 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

03-7XXXX-10

part stock: 10644

Type: SIP, Number of Positions or Pins (Grid): 3 (1 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

03-71250-10

part stock: 10628

Type: SIP, Number of Positions or Pins (Grid): 3 (1 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

03-7630-10

part stock: 10636

Type: SIP, Number of Positions or Pins (Grid): 3 (1 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

08-6823-90

part stock: 10677

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

06-0501-31

part stock: 10945

Type: SIP, Number of Positions or Pins (Grid): 6 (1 x 6), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

08-2503-21

part stock: 10887

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

06-0501-21

part stock: 10969

Type: SIP, Number of Positions or Pins (Grid): 6 (1 x 6), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

08-2503-31

part stock: 10949

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

06-3508-21

part stock: 11097

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 6 (2 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

06-3508-31

part stock: 11169

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 6 (2 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

05-0501-31

part stock: 11426

Type: SIP, Number of Positions or Pins (Grid): 5 (1 x 5), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

05-0501-21

part stock: 11423

Type: SIP, Number of Positions or Pins (Grid): 5 (1 x 5), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Phosphor Bronze,

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Aries Electronics

08-6810-90C

part stock: 11404

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

09-0508-31

part stock: 11575

Type: SIP, Number of Positions or Pins (Grid): 9 (1 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

09-0508-21

part stock: 11531

Type: SIP, Number of Positions or Pins (Grid): 9 (1 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

08-8620-210C

part stock: 11531

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

08-8430-210C

part stock: 11550

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

08-8255-210C

part stock: 11593

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

08-81250-210C

part stock: 11586

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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3600

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