Sockets for ICs, Transistors

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Sockets for ICs, Transistors

Aries Electronics

04-1518-11

part stock: 125183

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 4 (2 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

01-0503-30

part stock: 129885

Type: SIP, Number of Positions or Pins (Grid): 1 (1 x 1), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

01-0503-20

part stock: 129836

Type: SIP, Number of Positions or Pins (Grid): 1 (1 x 1), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

04-0513-10T

part stock: 129860

Type: SIP, Number of Positions or Pins (Grid): 4 (1 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

02-0513-11H

part stock: 130186

Type: SIP, Number of Positions or Pins (Grid): 2 (1 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

04-0513-10

part stock: 130229

Type: SIP, Number of Positions or Pins (Grid): 4 (1 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

02-1518-11H

part stock: 130210

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 2 (1 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

02-0518-11H

part stock: 130257

Type: SIP, Number of Positions or Pins (Grid): 2 (1 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

04-1518-00

part stock: 130277

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 4 (2 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

02-0513-11

part stock: 135544

Type: SIP, Number of Positions or Pins (Grid): 2 (1 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

04-1518-10H

part stock: 135544

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 4 (2 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

05-0518-10

part stock: 135554

Type: SIP, Number of Positions or Pins (Grid): 5 (1 x 5), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

04-0518-10H

part stock: 135508

Type: SIP, Number of Positions or Pins (Grid): 4 (1 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

01-0508-20

part stock: 141658

Type: SIP, Number of Positions or Pins (Grid): 1 (1 x 1), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

04-1518-10T

part stock: 141693

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 4 (2 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

01-0508-30

part stock: 141670

Type: SIP, Number of Positions or Pins (Grid): 1 (1 x 1), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

04-0518-10T

part stock: 141720

Type: SIP, Number of Positions or Pins (Grid): 4 (1 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

03-0513-10

part stock: 148430

Type: SIP, Number of Positions or Pins (Grid): 3 (1 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

03-0518-11

part stock: 148442

Type: SIP, Number of Positions or Pins (Grid): 3 (1 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

02-0513-10H

part stock: 183146

Type: SIP, Number of Positions or Pins (Grid): 2 (1 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

04-0518-10

part stock: 183165

Type: SIP, Number of Positions or Pins (Grid): 4 (1 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

04-1518-10

part stock: 183111

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 4 (2 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

03-0513-10T

part stock: 192704

Type: SIP, Number of Positions or Pins (Grid): 3 (1 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

03-0518-10H

part stock: 192733

Type: SIP, Number of Positions or Pins (Grid): 3 (1 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

01-0517-90C

part stock: 176983

Type: SIP, Number of Positions or Pins (Grid): 1 (1 x 1), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

03-0518-10T

part stock: 178446

Type: SIP, Number of Positions or Pins (Grid): 3 (1 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

03-0518-10

part stock: 124829

Type: SIP, Number of Positions or Pins (Grid): 3 (1 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

02-2513-10

part stock: 151974

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 2 (1 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

02-3513-10

part stock: 149728

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 2 (1 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

02-4513-10

part stock: 183397

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 2 (1 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

01-0513-11H

part stock: 167116

Type: SIP, Number of Positions or Pins (Grid): 1 (1 x 1), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

02-1518-11

part stock: 178782

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 2 (1 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

02-0518-11

part stock: 125144

Type: SIP, Number of Positions or Pins (Grid): 2 (1 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

01-0518-11H

part stock: 193108

Type: SIP, Number of Positions or Pins (Grid): 1 (1 x 1), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

03-0518-00

part stock: 194290

Type: SIP, Number of Positions or Pins (Grid): 3 (1 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Aries Electronics

02-0513-10

part stock: 192535

Type: SIP, Number of Positions or Pins (Grid): 2 (1 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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3600

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