Sockets for ICs, Transistors | Connectors, Interconnects | 5

SIP1X32-041BLF

part stock: 4059

Type: SIP, Number of Positions or Pins (Grid): 32 (1 x 32), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X08-160BLF

part stock: 4175

Type: SIP, Number of Positions or Pins (Grid): 8 (1 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X19-160BLF

part stock: 4174

Type: SIP, Number of Positions or Pins (Grid): 19 (1 x 19), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X20-160BLF

part stock: 4029

Type: SIP, Number of Positions or Pins (Grid): 20 (1 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

DIP316-014BLF

part stock: 9695

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP1X15-011BLF

part stock: 3959

Type: SIP, Number of Positions or Pins (Grid): 15 (1 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X29-157BLF

part stock: 4245

Type: SIP, Number of Positions or Pins (Grid): 29 (1 x 29), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP1X16-014BLF

part stock: 3845

Type: SIP, Number of Positions or Pins (Grid): 16 (1 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 150.0µin (3.81µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

DILB18P-223TLF

part stock: 168913

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Copper Alloy,

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Amphenol ICC (FCI)

SIP1X27-014BLF

part stock: 3859

Type: SIP, Number of Positions or Pins (Grid): 27 (1 x 27), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 150.0µin (3.81µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X24-157BLF

part stock: 8513

Type: SIP, Number of Positions or Pins (Grid): 24 (1 x 24), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP1X08-014BLF

part stock: 3887

Type: SIP, Number of Positions or Pins (Grid): 8 (1 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 150.0µin (3.81µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X14-157BLF

part stock: 4141

Type: SIP, Number of Positions or Pins (Grid): 14 (1 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

DILB14P-223TLF

part stock: 115921

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 14 (2 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Copper Alloy,

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Amphenol ICC (FCI)

DIP050-628-157BLF

part stock: 9702

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP1X04-014BLF

part stock: 3845

Type: SIP, Number of Positions or Pins (Grid): 4 (1 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 150.0µin (3.81µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X09-160BLF

part stock: 4090

Type: SIP, Number of Positions or Pins (Grid): 9 (1 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X13-160BLF

part stock: 4210

Type: SIP, Number of Positions or Pins (Grid): 13 (1 x 13), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X12-160BLF

part stock: 4137

Type: SIP, Number of Positions or Pins (Grid): 12 (1 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP1X12-011BLF

part stock: 3889

Type: SIP, Number of Positions or Pins (Grid): 12 (1 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X29-160BLF

part stock: 4175

Type: SIP, Number of Positions or Pins (Grid): 29 (1 x 29), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X06-157BLF

part stock: 4111

Type: SIP, Number of Positions or Pins (Grid): 6 (1 x 6), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X30-160BLF

part stock: 4208

Type: SIP, Number of Positions or Pins (Grid): 30 (1 x 30), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X11-160BLF

part stock: 4137

Type: SIP, Number of Positions or Pins (Grid): 11 (1 x 11), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP1X30-041BLF

part stock: 4063

Type: SIP, Number of Positions or Pins (Grid): 30 (1 x 30), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP1X20-041BLF

part stock: 4027

Type: SIP, Number of Positions or Pins (Grid): 20 (1 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP1X07-014BLF

part stock: 8467

Type: SIP, Number of Positions or Pins (Grid): 7 (1 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 150.0µin (3.81µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X21-157BLF

part stock: 4130

Type: SIP, Number of Positions or Pins (Grid): 21 (1 x 21), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP1X32-011BLF

part stock: 3853

Type: SIP, Number of Positions or Pins (Grid): 32 (1 x 32), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X04-160BLF

part stock: 4001

Type: SIP, Number of Positions or Pins (Grid): 4 (1 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP1X06-014BLF

part stock: 8460

Type: SIP, Number of Positions or Pins (Grid): 6 (1 x 6), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 150.0µin (3.81µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP1X02-001BLF

part stock: 3987

Type: SIP, Number of Positions or Pins (Grid): 2 (1 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X31-160BLF

part stock: 8495

Type: SIP, Number of Positions or Pins (Grid): 31 (1 x 31), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP1X12-014BLF

part stock: 3870

Type: SIP, Number of Positions or Pins (Grid): 12 (1 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 150.0µin (3.81µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X26-160BLF

part stock: 4222

Type: SIP, Number of Positions or Pins (Grid): 26 (1 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X19-157BLF

part stock: 4095

Type: SIP, Number of Positions or Pins (Grid): 19 (1 x 19), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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