Sockets for ICs, Transistors | Connectors, Interconnects | 5

SIP1X08-011BLF

part stock: 3851

Type: SIP, Number of Positions or Pins (Grid): 8 (1 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP1X02-011BLF

part stock: 3976

Type: SIP, Number of Positions or Pins (Grid): 2 (1 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SPF080-1X08-998Z

part stock: 4077

Type: SIP, Number of Positions or Pins (Grid): 8 (1 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 200.0µin (5.08µm),

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Amphenol ICC (FCI)

DIP324-011BLF

part stock: 3957

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X04-157BLF

part stock: 3981

Type: SIP, Number of Positions or Pins (Grid): 4 (1 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

DPF308-998Z

part stock: 4268

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X22-160BLF

part stock: 4158

Type: SIP, Number of Positions or Pins (Grid): 22 (1 x 22), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X11-157BLF

part stock: 4043

Type: SIP, Number of Positions or Pins (Grid): 11 (1 x 11), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP41430-001LF

part stock: 9907

Type: SIP, Number of Positions or Pins (Grid): 2 (1 x 2), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

DILB40P-223TLF

part stock: 126353

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Copper Alloy,

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Amphenol ICC (FCI)

SIP050-1X03-157BLF

part stock: 4139

Type: SIP, Number of Positions or Pins (Grid): 3 (1 x 3), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

DIP632-001BLF

part stock: 3932

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP1X20-011BLF

part stock: 9684

Type: SIP, Number of Positions or Pins (Grid): 20 (1 x 20), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP1X05-041BLF

part stock: 4003

Type: SIP, Number of Positions or Pins (Grid): 5 (1 x 5), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP1X09-001BLF

part stock: 3864

Type: SIP, Number of Positions or Pins (Grid): 9 (1 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP1X05-011BLF

part stock: 3821

Type: SIP, Number of Positions or Pins (Grid): 5 (1 x 5), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X21-160BLF

part stock: 4268

Type: SIP, Number of Positions or Pins (Grid): 21 (1 x 21), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X23-160BLF

part stock: 4165

Type: SIP, Number of Positions or Pins (Grid): 23 (1 x 23), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

DIP324-001BLF

part stock: 9708

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP1X32-014BLF

part stock: 8411

Type: SIP, Number of Positions or Pins (Grid): 32 (1 x 32), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 150.0µin (3.81µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X17-160BLF

part stock: 8445

Type: SIP, Number of Positions or Pins (Grid): 17 (1 x 17), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X26-157BLF

part stock: 4109

Type: SIP, Number of Positions or Pins (Grid): 26 (1 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X30-157BLF

part stock: 4208

Type: SIP, Number of Positions or Pins (Grid): 30 (1 x 30), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X15-160BLF

part stock: 4160

Type: SIP, Number of Positions or Pins (Grid): 15 (1 x 15), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X05-157BLF

part stock: 4045

Type: SIP, Number of Positions or Pins (Grid): 5 (1 x 5), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SPF080-1X10-998Z

part stock: 4094

Type: SIP, Number of Positions or Pins (Grid): 10 (1 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 200.0µin (5.08µm),

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Amphenol ICC (FCI)

SIP050-1X25-157BLF

part stock: 4155

Type: SIP, Number of Positions or Pins (Grid): 25 (1 x 25), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X31-157BLF

part stock: 4312

Type: SIP, Number of Positions or Pins (Grid): 31 (1 x 31), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

DPF314-998Z

part stock: 4242

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 14 (2 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X06-160BLF

part stock: 4131

Type: SIP, Number of Positions or Pins (Grid): 6 (1 x 6), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP1X08-001BLF

part stock: 8449

Type: SIP, Number of Positions or Pins (Grid): 8 (1 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X32-157BLF

part stock: 4235

Type: SIP, Number of Positions or Pins (Grid): 32 (1 x 32), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

DPF316-998Z

part stock: 4323

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X28-157BLF

part stock: 8439

Type: SIP, Number of Positions or Pins (Grid): 28 (1 x 28), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

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Amphenol ICC (FCI)

DILB24P-224TLF

part stock: 154728

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Copper Alloy,

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Amphenol ICC (FCI)

SIP050-1X16-160BLF

part stock: 4123

Type: SIP, Number of Positions or Pins (Grid): 16 (1 x 16), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

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