Sockets for ICs, Transistors

110-43-322-41-105000

part stock: 61

117-41-316-41-005000

part stock: 115

110-43-422-41-105000

part stock: 79

111-91-428-41-001000

part stock: 80

111-41-328-41-001000

part stock: 55

111-91-328-41-001000

part stock: 97

111-41-628-41-001000

part stock: 98

111-91-628-41-001000

part stock: 125

111-41-428-41-001000

part stock: 115

110-41-652-41-001000

part stock: 39

115-44-632-41-003000

part stock: 47

116-91-320-41-007000

part stock: 115

110-91-652-41-001000

part stock: 5590

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

116-91-420-41-007000

part stock: 47

116-41-320-41-007000

part stock: 111

116-41-420-41-007000

part stock: 81

122-13-308-41-001000

part stock: 5584

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

110-91-636-41-001000

part stock: 5547

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 36 (2 x 18), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper,

110-41-636-41-001000

part stock: 118

146-93-314-41-012000

part stock: 5581

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 14 (2 x 7), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

146-43-314-41-012000

part stock: 46

110-44-650-41-001000

part stock: 30

122-13-210-41-001000

part stock: 5624

Type: DIP, 0.2" (5.08mm) Row Spacing, Number of Positions or Pins (Grid): 10 (2 x 5), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

101-93-318-41-560000

part stock: 5612

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

110-41-318-41-105000

part stock: 100

110-91-318-41-105000

part stock: 91

123-47-952-41-001000

part stock: 108

110-93-318-41-605000

part stock: 5606

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 18 (2 x 9), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

115-43-420-41-003000

part stock: 83

115-93-420-41-003000

part stock: 5582

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 20 (2 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

110-43-318-41-605000

part stock: 62

110-44-950-41-001000

part stock: 101

116-43-314-41-008000

part stock: 55

111-41-640-41-001000

part stock: 69

115-41-628-41-003000

part stock: 60

115-41-328-41-003000

part stock: 110