Sockets for ICs, Transistors

146-41-318-41-012000

part stock: 72

126-41-306-41-003000

part stock: 125

124-41-308-41-002000

part stock: 103

124-91-308-41-002000

part stock: 103

116-93-420-41-006000

part stock: 5535

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 20 (2 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-43-420-41-006000

part stock: 71

116-93-320-41-006000

part stock: 5537

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 20 (2 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

110-93-628-41-605000

part stock: 19178

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

110-43-628-41-605000

part stock: 100

116-43-320-41-006000

part stock: 82

126-41-314-41-001000

part stock: 31

126-91-314-41-001000

part stock: 29

114-93-420-41-117000

part stock: 5518

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 20 (2 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

114-43-420-41-117000

part stock: 49

114-93-320-41-117000

part stock: 5602

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 20 (2 x 10), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

114-43-320-41-117000

part stock: 111

146-91-320-41-013000

part stock: 95

146-41-320-41-013000

part stock: 105

104-11-210-41-780000

part stock: 46

110-99-652-41-001000

part stock: 5575

Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 52 (2 x 26), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper,

117-91-428-41-005000

part stock: 52

117-41-428-41-005000

part stock: 37

110-13-422-41-001000

part stock: 5556

Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 22 (2 x 11), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

110-13-322-41-001000

part stock: 5585

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 22 (2 x 11), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-41-316-41-006000

part stock: 38

116-91-316-41-006000

part stock: 88

116-91-210-41-001000

part stock: 28

116-41-210-41-001000

part stock: 87

116-91-422-41-003000

part stock: 123

116-41-322-41-003000

part stock: 106

116-91-322-41-003000

part stock: 48

116-41-324-41-006000

part stock: 106

126-93-308-41-002000

part stock: 5614

Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 8 (2 x 4), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper,

116-41-624-41-006000

part stock: 51

116-91-424-41-006000

part stock: 65

110-91-628-41-605000

part stock: 75