Type: Solder Paste, Flux Type: No-Clean,
Type: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Melting Point: 423°F (217°C), Flux Type: No-Clean,
Type: Solder Paste, Composition: Sn63Pb37 (63/37), Melting Point: 361°F (183°C), Flux Type: No-Clean,
Type: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Melting Point: 423°F (217°C),
Type: Solder Paste, Melting Point: 546 ~ 567°F (286 ~ 297°C),
Type: Wire Solder, Composition: Sn60Pb40 (60/40), Diameter: 0.064" (1.63mm), Melting Point: 361 ~ 374°F (183 ~ 190°C), Flux Type: No-Clean, Wire Gauge: 14 AWG, 16 SWG,
Type: Wire Solder, Composition: Sn96.5Ag3.5 (96.5/3.5), Diameter: 0.063" (1.60mm), Melting Point: 430°F (221°C), Wire Gauge: 14 AWG, 16 SWG,
Type: Solder Paste, Composition: Sn63Pb37 (63/37), Melting Point: 361°F (183°C), Flux Type: Water Soluble,
Type: Wire Solder, Composition: Sn63Pb37 (63/37), Diameter: 0.032" (0.81mm), Melting Point: 361°F (183°C), Flux Type: Rosin Mildly Activated (RMA), Wire Gauge: 20 AWG, 21 SWG,
Type: Wire Solder, Composition: Sn63Pb37 (63/37), Diameter: 0.022" (0.56mm), Melting Point: 361°F (183°C), Flux Type: Rosin Mildly Activated (RMA), Wire Gauge: 23 AWG, 24 SWG,
Type: Solder Paste, Composition: Bi58Sn42 (58/42), Melting Point: 281°F (138°C), Flux Type: No-Clean,
Type: Solder Paste, Composition: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Melting Point: 411 ~ 424°F (209 ~ 218°C), Flux Type: No-Clean,
Type: Solder Paste, Composition: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Melting Point: 410 ~ 424°F (209 ~ 218°C), Flux Type: No-Clean,
Type: Solder Paste, Composition: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Melting Point: 409 ~ 424°F (209 ~ 218°C), Flux Type: No-Clean,
Type: Solder Paste, Composition: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Melting Point: 408 ~ 424°F (209 ~ 218°C), Flux Type: No-Clean,
Type: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Melting Point: 350°F (177°C), Flux Type: No-Clean,
Type: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Melting Point: 401 ~ 424°F (205 ~ 218°C), Flux Type: No-Clean,
Type: Solder Paste, Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Melting Point: 423°F (217°C), Flux Type: No-Clean,
Type: Solder Paste, Composition: Sn62Pb36Ag2 (62/36/2), Melting Point: 354°F (179°C), Flux Type: Water Soluble,
Type: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Melting Point: 423°F (217°C), Flux Type: Water Soluble,
